PRパルス電解を用いたリードフレーム上の粒状硫酸銅めっき形成
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| Published in | スマートプロセス学会誌 Vol. 13; no. 5; pp. 233 - 239 |
|---|---|
| Main Authors | , , , |
| Format | Journal Article |
| Language | Japanese |
| Published |
一般社団法人 スマートプロセス学会 （旧高温学会）
10.09.2024
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| Online Access | Get full text |
| ISSN | 2186-702X 2187-1337 |
| DOI | 10.7791/jspmee.13.233 |
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| Author | 大野, 厚三 中, 亮太 石原, 隆雄 吉川, 純二 |
|---|---|
| Author_xml | – sequence: 1 fullname: 中, 亮太 organization: 奥野製薬工業株式会社 – sequence: 1 fullname: 石原, 隆雄 organization: 日電精密工業株式会社 – sequence: 1 fullname: 大野, 厚三 organization: 日電精密工業株式会社 – sequence: 1 fullname: 吉川, 純二 organization: 奥野製薬工業株式会社 |
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| DOI | 10.7791/jspmee.13.233 |
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| References | 3） H. Sakisako, M. Kimura, and Y. Morikawa: “Pretreatment for Electroplateing of Printed Wiring Board -Black Oxide Treatment, Desmear Treatment-”, Journal of the Surface Finishing Society of Japan, 44-7 （1993）, 573-577. （in Japanese 1） A. Aiba: “Post Surface Treatment Agent and Technology for IC Leadframe with High Performance and Reliability”, Journal of the Surface Finishing Society of Japan, 60-4 （2009）, 243-247. （in Japanese 7） T. Ishihara, K. Oono, and K. Kondo: “Plating Solution, Plating Method and Metal Materials”, Patent disclosed 2022-127982, （2022）. （in Japanese 6） K. Kubota and K. Nakatani: “Lead Frame and Its Manufacturing method”, Patent disclosed 2019-204913, （2019）. （in Japanese 2） TOPPAN Holdings Inc. S. Maniwa: “Lead Frame board with resin”, Patent disclosed 2017-92247. （2017）. （in Japanese 4） Furukawa Electric Co., Ltd.: “Roughening Copper Plating with High Resin Adhesion”, Furukawa Electric Review, 140 （2021）, 49-50. （in Japanese 8） R. Naka, J. Yoshikawa, T. Ishihara, and K. Oono: “Development of Forming Roughened Copper Plating for Improving Adhesion Reliability with Mold Resin by PR Pulsed Electrodeposition”, Proceedings of JIEP Annual Meeting, 37 （2023）, 31-34. （in Japanese 5） Furukawa Electric Co., Ltd. S. Katahira: “Roughened Copper Foil, Copper-Clad Laminate, and Printed Wiring Board”, Patent disclosed 7051988. （2022）. （in Japanese |
| References_xml | – reference: 6） K. Kubota and K. Nakatani: “Lead Frame and Its Manufacturing method”, Patent disclosed 2019-204913, （2019）. （in Japanese） – reference: 7） T. Ishihara, K. Oono, and K. Kondo: “Plating Solution, Plating Method and Metal Materials”, Patent disclosed 2022-127982, （2022）. （in Japanese） – reference: 2） TOPPAN Holdings Inc. S. Maniwa: “Lead Frame board with resin”, Patent disclosed 2017-92247. （2017）. （in Japanese） – reference: 3） H. Sakisako, M. Kimura, and Y. Morikawa: “Pretreatment for Electroplateing of Printed Wiring Board -Black Oxide Treatment, Desmear Treatment-”, Journal of the Surface Finishing Society of Japan, 44-7 （1993）, 573-577. （in Japanese） – reference: 5） Furukawa Electric Co., Ltd. S. Katahira: “Roughened Copper Foil, Copper-Clad Laminate, and Printed Wiring Board”, Patent disclosed 7051988. （2022）. （in Japanese） – reference: 1） A. Aiba: “Post Surface Treatment Agent and Technology for IC Leadframe with High Performance and Reliability”, Journal of the Surface Finishing Society of Japan, 60-4 （2009）, 243-247. （in Japanese） – reference: 8） R. Naka, J. Yoshikawa, T. Ishihara, and K. Oono: “Development of Forming Roughened Copper Plating for Improving Adhesion Reliability with Mold Resin by PR Pulsed Electrodeposition”, Proceedings of JIEP Annual Meeting, 37 （2023）, 31-34. （in Japanese） – reference: 4） Furukawa Electric Co., Ltd.: “Roughening Copper Plating with High Resin Adhesion”, Furukawa Electric Review, 140 （2021）, 49-50. （in Japanese） |
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| Title | PRパルス電解を用いたリードフレーム上の粒状硫酸銅めっき形成 |
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