狭間隙部へのシリカ粒子－液状エポキシ樹脂分散系の充過程に及ぼす粒子体積分率と表面改質剤の影響
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| Published in | 粉体工学会誌 Vol. 50; no. 8; pp. 552 - 560 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
一般社団法人 粉体工学会
10.08.2013
|
| Online Access | Get full text |
| ISSN | 0386-6157 1883-7239 |
| DOI | 10.4164/sptj.50.552 |
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| Author | 深澤, 智典 新戸, 浩幸 藤﨑, 和也 太田, 賢 松岡, 佑樹 |
|---|---|
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| References | 11) Mewis, J. and N. J. Wagner : In "Colloidal Suspension Rheology", Chapter 3, Cambridge University Press (2011 13) Washburn, E. W. : "The dynamics of capillary flow", Phys. Rev., 17, 273-283 (1921 2) Nagata, K. : In "Sosetsu Epokishi Jushi", The Japan Society of Epoxy Resin Technol., 2, 13-21 (2003 4) Guo, Y., G. L. Lehmann, T. Driscoll and E. J. Cotts : "A model of the underfill flow process : Particle distribution effects", Proc. of 49th Electronic Components and Technology Conference, pp. 71-76, San Diego (1999 10) Vincent, M. B., L. Meyers and C. P. Wong : "Enhancement of underfill performance for flip-chip applications by use of silane additives", Proc. of 48th Electronic Components and Technology Conference, pp. 125-131, Seattle (1998 12) Binks, B. P. : "Particles as surfactants-similarities and differences", Curr. Opin. Colloid Interface Sci., 7, 21-41 (2002 18) Mewis, J. and N. J. Wagner : "Colloidal Suspension Rheology", p. 63-67, Cambridge University Press (2011 9) Xiang, D., M. V. Brillhart, M. Roesch and P. S. Ho : "Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging", IEEE Trans. Comp. Pack. Technol., 23, 117-127 (2000 15) Berg, J. C. : "An Introduction to Interfaces & Colloids : The Bridge to Nanoscience", pp. 297-309, World Scientific (2010 1) Honma, Y. : In "osetsu Epokishi Jushi", The Japan Society of Epoxy Resin Technol., 3, 161-166 (2003 14) Yasuda, K., R. C. Armstrong and R. E. Cohen : "Shear flow properties of concentrated solutions of linear and star branched polystyrenes", Rheol. Acta, 20, 163-178 (1981 7) Fujisaki, K., Y. Matsuoka, K. Oota, T. Fukasawa and H. Shinto : "Solid / liquid interfacial structures, surface forces, and rheology of colloidal dispersions comprised of silica particles suspended in liquid epoxy resins", J. Soc. Powder Technol., Japan, 49, 599-607 (2012 5) Wan, J. W., W. J. Zhang and D. J. Bergstrom : "Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging", Microelectron. Reliab., 48, 425-430 (2008 8) Qizhou, Y., Q. Jianmin, W. Jiali and C. P. Wong : "Quantitative characterization of underfill / substrate interfacial toughness enhancement by silane additives", Proc. of 49th Electronic Components and Technology Conference, pp. 1079-1082, San Diego (1999 3) Lehmann, G. L., T. Driscoll, N. R. Guydosh, P. C. Li and E. J. Cotts : "Underflow process for direct-chip-attachment packaging", IEEE Trans. Comp. Pack. Manufact. Technol., Part A, 21, 266-274 (1998 17) Kistler, S. F. : In "Wettability", J. C. Berg (Ed.), Chapter 6, Marcel Dekker (1993 6) Young, W. B. : "Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation", Microelectron. Reliab., 50, 995-999 (2010 16) Mewis, J. and N. J. Wagner : "Colloidal Suspension Rheology", Chapter 8, Cambridge University Press (2011 |
| References_xml | – reference: 8) Qizhou, Y., Q. Jianmin, W. Jiali and C. P. Wong : "Quantitative characterization of underfill / substrate interfacial toughness enhancement by silane additives", Proc. of 49th Electronic Components and Technology Conference, pp. 1079-1082, San Diego (1999) – reference: 16) Mewis, J. and N. J. Wagner : "Colloidal Suspension Rheology", Chapter 8, Cambridge University Press (2011) – reference: 9) Xiang, D., M. V. Brillhart, M. Roesch and P. S. Ho : "Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging", IEEE Trans. Comp. Pack. Technol., 23, 117-127 (2000) – reference: 5) Wan, J. W., W. J. Zhang and D. J. Bergstrom : "Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging", Microelectron. Reliab., 48, 425-430 (2008) – reference: 11) Mewis, J. and N. J. Wagner : In "Colloidal Suspension Rheology", Chapter 3, Cambridge University Press (2011) – reference: 12) Binks, B. P. : "Particles as surfactants-similarities and differences", Curr. Opin. Colloid Interface Sci., 7, 21-41 (2002) – reference: 10) Vincent, M. B., L. Meyers and C. P. Wong : "Enhancement of underfill performance for flip-chip applications by use of silane additives", Proc. of 48th Electronic Components and Technology Conference, pp. 125-131, Seattle (1998) – reference: 17) Kistler, S. F. : In "Wettability", J. C. Berg (Ed.), Chapter 6, Marcel Dekker (1993) – reference: 18) Mewis, J. and N. J. Wagner : "Colloidal Suspension Rheology", p. 63-67, Cambridge University Press (2011) – reference: 7) Fujisaki, K., Y. Matsuoka, K. Oota, T. Fukasawa and H. Shinto : "Solid / liquid interfacial structures, surface forces, and rheology of colloidal dispersions comprised of silica particles suspended in liquid epoxy resins", J. Soc. Powder Technol., Japan, 49, 599-607 (2012) – reference: 1) Honma, Y. : In "osetsu Epokishi Jushi", The Japan Society of Epoxy Resin Technol., 3, 161-166 (2003) – reference: 14) Yasuda, K., R. C. Armstrong and R. E. Cohen : "Shear flow properties of concentrated solutions of linear and star branched polystyrenes", Rheol. Acta, 20, 163-178 (1981) – reference: 4) Guo, Y., G. L. Lehmann, T. Driscoll and E. J. Cotts : "A model of the underfill flow process : Particle distribution effects", Proc. of 49th Electronic Components and Technology Conference, pp. 71-76, San Diego (1999) – reference: 6) Young, W. B. : "Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation", Microelectron. Reliab., 50, 995-999 (2010) – reference: 2) Nagata, K. : In "Sosetsu Epokishi Jushi", The Japan Society of Epoxy Resin Technol., 2, 13-21 (2003) – reference: 13) Washburn, E. W. : "The dynamics of capillary flow", Phys. Rev., 17, 273-283 (1921) – reference: 3) Lehmann, G. L., T. Driscoll, N. R. Guydosh, P. C. Li and E. J. Cotts : "Underflow process for direct-chip-attachment packaging", IEEE Trans. Comp. Pack. Manufact. Technol., Part A, 21, 266-274 (1998) – reference: 15) Berg, J. C. : "An Introduction to Interfaces & Colloids : The Bridge to Nanoscience", pp. 297-309, World Scientific (2010) |
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| Title | 狭間隙部へのシリカ粒子－液状エポキシ樹脂分散系の充過程に及ぼす粒子体積分率と表面改質剤の影響 |
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