Compact Dual-Port MIMO Microstrip Patch Antenna for Terahertz Applications in 6G Communications

• Published in: Devices for Integrated Circuit pp. 778 - 783
• Main Authors: Barua, Nirzar, Islam, Akib Jayed, Uddin, Arafat, Salehin, Sultanus, Pavel, Tanvir A., Ananna, Kaniz Fatema
• Format: Conference Proceeding
• Language: English
• Published: IEEE 05.04.2025
• Subjects: 6G mobile communication; antenna array; Arrays; Bandwidth; Data transfer; dual port; Gain; Microstrip; Microstrip antenna arrays; Microstrip antennas; Microwave antennas; MIMO; miniaturization; Terahertz communications; terahertz-band; THz communications
• ISSN: 2996-3044
• DOI: 10.1109/DevIC63749.2025.11012192

This study introduces a dual-port MIMO antenna featuring a two-element microstrip patch array, specifically designed for THz applications with an emphasis on 6G communication systems. Developed on an FR-4 substrate with copper elements, the antenna achieves notable miniaturization, with dimensions of 52 × 48.5 µm 2 and a thickness of 1.6 µm. By incorporating an H-shaped slot and strategic notches, the patch size is reduced by 51%. The proposed design exhibits a primary resonant frequency at 2.71 THz, with secondary resonances at 4.3 THz and 5.7 THz, achieving return loss values of 40.40 dB and approximately -30 dB, respectively. The antenna demonstrates a gain of 3.15 dBi, linear polarization, and high directivity. Simulations conducted in CST Microwave Studio validate the antenna's high performance, including a broad operational bandwidth of 4.69 THz covering the range from 2.22 THz to 6.91 THz, excellent impedance matching with a VSWR of 1.01, and an efficiency of 61%. The dual port MIMO configuration ensures minimal mutual coupling, evidenced by a low ECC of 3.26 × 10 −5 and a reduced CCL including the isolation of 25 dB. These results confirm the antenna's suitability for advanced applications such as terahertz communications, high-speed data transfer, and sensing systems, offering an optimal combination of compactness, efficiency, and reliability.