Novel Stress Migration Failure Analysis by EBSD-KAM - Ku, Chih-Feng; Li, Yu-Lin; Lin, Yu-Chiao; Kao, C.K.; Shih, Ting-Ying; Yang, Huei-Wen (IEEE International Reliability Physics Symposium proceedings, 2025)
Keywords: Copper; Electron backscatter diffraction; Electron backscatter diffraction (EBSD); Failure analysis; Integrated circuit interconnections; Junctions; Kernel; Kernel Average Misorientation (KAM); Physics; Reliability; Resistance; Stress; Stress migration; Visualization