Ku, C., Li, Y., Lin, Y., Kao, C., Shih, T., & Yang, H. (2025, March 30). Novel Stress Migration Failure Analysis by EBSD-KAM. IEEE International Reliability Physics Symposium proceedings, 1-4. https://doi.org/10.1109/IRPS48204.2025.10982797
Chicago Style (17th ed.) CitationKu, Chih-Feng, Yu-Lin Li, Yu-Chiao Lin, C.K Kao, Ting-Ying Shih, and Huei-Wen Yang. "Novel Stress Migration Failure Analysis by EBSD-KAM." IEEE International Reliability Physics Symposium Proceedings 30 Mar. 2025: 1-4. https://doi.org/10.1109/IRPS48204.2025.10982797.
MLA (9th ed.) CitationKu, Chih-Feng, et al. "Novel Stress Migration Failure Analysis by EBSD-KAM." IEEE International Reliability Physics Symposium Proceedings, 30 Mar. 2025, pp. 1-4, https://doi.org/10.1109/IRPS48204.2025.10982797.