Thermal comfort study in urban low-cost residential building in Shah Alam

The objective of this research is to investigate on the thermal comfort condition of low-cost multi-storey residential building located in the urban area in Malaysia. This study began with the selection of six-storey apartment blocks located in Section 7, Shah Alam as the case study project. Then, d...

Full description

Saved in:
Bibliographic Details
Published in2011 IEEE Symposium on Business, Engineering and Industrial Applications pp. 303 - 307
Main Authors Harahap, R. K., Karim, H. A., Ahmad, P., Harahap, M. I. P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2011
Subjects
Online AccessGet full text
ISBN9781457715488
1457715481
DOI10.1109/ISBEIA.2011.6088826

Cover

Abstract The objective of this research is to investigate on the thermal comfort condition of low-cost multi-storey residential building located in the urban area in Malaysia. This study began with the selection of six-storey apartment blocks located in Section 7, Shah Alam as the case study project. Then, data in form of thermal comfort elements and building elements were collected from 47 apartment units from 23rd of November 2010 to 2nd of December 2010 at two (2) different time intervals, i.e. afternoon and evening. Data of these two parameters were then cross-tabulated using SPSS and described in terms of mean or average value of dry-bulb temperature, relative humidity and air velocity. These values were further summed up in a table to indicate minimum and maximum measures only. They were then compared with the current thermal comfort standard as well as precedent studies on the subject. Finally the results indicated that the thermal performance of urban low-cost apartment in Malaysia is still within the comfort range. However this condition can be further improved should the recommendations suggested being considered and implemented in future low-cost housing development in Malaysia.
AbstractList The objective of this research is to investigate on the thermal comfort condition of low-cost multi-storey residential building located in the urban area in Malaysia. This study began with the selection of six-storey apartment blocks located in Section 7, Shah Alam as the case study project. Then, data in form of thermal comfort elements and building elements were collected from 47 apartment units from 23rd of November 2010 to 2nd of December 2010 at two (2) different time intervals, i.e. afternoon and evening. Data of these two parameters were then cross-tabulated using SPSS and described in terms of mean or average value of dry-bulb temperature, relative humidity and air velocity. These values were further summed up in a table to indicate minimum and maximum measures only. They were then compared with the current thermal comfort standard as well as precedent studies on the subject. Finally the results indicated that the thermal performance of urban low-cost apartment in Malaysia is still within the comfort range. However this condition can be further improved should the recommendations suggested being considered and implemented in future low-cost housing development in Malaysia.
Author Karim, H. A.
Harahap, R. K.
Harahap, M. I. P.
Ahmad, P.
Author_xml – sequence: 1
  givenname: R. K.
  surname: Harahap
  fullname: Harahap, R. K.
  email: rohimah@salam.uitm.edu.my
  organization: Fac. of Archit., Planning & Surveying, Univ. Teknol. MARA, Shah Alam, Malaysia
– sequence: 2
  givenname: H. A.
  surname: Karim
  fullname: Karim, H. A.
  email: hafazah846@salam.uitm.edu.my
  organization: Fac. of Archit., Planning & Surveying, Univ. Teknol. MARA, Shah Alam, Malaysia
– sequence: 3
  givenname: P.
  surname: Ahmad
  fullname: Ahmad, P.
  email: puziah318@salam.uitm.edu.my
  organization: Fac. of Archit., Planning & Surveying, Univ. Teknol. MARA, Shah Alam, Malaysia
– sequence: 4
  givenname: M. I. P.
  surname: Harahap
  fullname: Harahap, M. I. P.
  email: moham581@penang.uitm.edu.my
  organization: Fac. of Archit., Planning & Surveying, Univ. Teknol. MARA, Shah Alam, Malaysia
BookMark eNpVj81KxDAcxCMqqGufYC95gdZ_mo8mx7qsWljwsL0vaZrYSJtK0yL79lbci3MZBn7MMA_oJozBIrQlkBEC6qk6Pu-rMsuBkEyAlDIXVyhRhSSMFwXhTPHrf1nKO5TE-AmrhJCS83tU1Z2dBt1jMw5unGYc56U9Yx_wMjU64H78Ts0YZzzZ6FsbZr-yzeL71oePX-zY6Q6XvR4e0a3TfbTJxTeoftnXu7f08P5a7cpD6hXM6bpKoAFWUA3cGQtE0hw4aU1OqXLKMKKd4wXJtQBqrJMArmEtV9oywSjdoO1frbfWnr4mP-jpfLr8pz-yJk-t
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/ISBEIA.2011.6088826
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Xplore POP ALL
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 9781457715495
1457715473
9781457715471
145771549X
EndPage 307
ExternalDocumentID 6088826
Genre orig-research
GroupedDBID 6IE
6IF
6IK
6IL
6IN
AAJGR
AAWTH
ADFMO
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
IEGSK
IERZE
OCL
RIE
RIL
ID FETCH-LOGICAL-i90t-88510b0473a05fce01832051dc2339f9c41aff5712a603cef800fb4d59ae46433
IEDL.DBID RIE
ISBN 9781457715488
1457715481
IngestDate Wed Aug 27 03:10:14 EDT 2025
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i90t-88510b0473a05fce01832051dc2339f9c41aff5712a603cef800fb4d59ae46433
PageCount 5
ParticipantIDs ieee_primary_6088826
PublicationCentury 2000
PublicationDate 2011-Sept.
PublicationDateYYYYMMDD 2011-09-01
PublicationDate_xml – month: 09
  year: 2011
  text: 2011-Sept.
PublicationDecade 2010
PublicationTitle 2011 IEEE Symposium on Business, Engineering and Industrial Applications
PublicationTitleAbbrev ISBEIA
PublicationYear 2011
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0000668855
Score 1.4791487
Snippet The objective of this research is to investigate on the thermal comfort condition of low-cost multi-storey residential building located in the urban area in...
SourceID ieee
SourceType Publisher
StartPage 303
SubjectTerms Buildings
Educational institutions
Humidity
Humidity measurement
low-cost apartment
passive design strategies
Temperature measurement
thermal comfort
Ventilation
Title Thermal comfort study in urban low-cost residential building in Shah Alam
URI https://ieeexplore.ieee.org/document/6088826
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3fS8MwEA7bnnxS2cTf5MFHs6VN0rSPUzacMBE2YW-jSRM2HK3MFsG_3kvaTRQffGtLKOFyl7tL7vsOoRvIERi3TBGVMUN4kBoCuUpMjOVchTFVmXXY4elT9PDCHxdi0UK3eyyMMcYXn5m-e_R3-VmhK3dUNojAJCAcbqO2lEmN1dqfp4DrjGMhPHZLSOki8WBH6dS8xw3rUECTwWR2N5oMawrP5rc_-qt49zI-RNPdxOqqktd-Vaq-_vzF2fjfmR-h3jeQDz_vXdQxapm8iyagGrAdbzAoG4SsJfYUs3id42qr0hxvig-ii_cSQya-9jheGKua9tlu2GyVrvAQVKmH5uPR_P6BNB0VyDqhJQEBBVRRLllKhdWGOnsGq8x0yFhiEw1rZa2QQZhGlGljIZq0imciSQ2H0IWdoE5e5OYU4YiFOlKWyUTCXus4dTKrMs5TGoUB1-wMdZ0Ulm81Z8ayEcD5358v0EHoakV87dYl6pTbylyBsy_VtV_lL7CRpJc
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3NS8MwFA9zHvSksonf5uDRbGmT9OM4ZWPVbQibsNto0gSHo5XZIvjX-9J2E8WDt7aEEpL38j7yfr-H0A3ECIwbJolMmCbciTWBWCUg2nAu3YDKxFjs8HjiDZ_5w1zMG-h2i4XRWpfFZ7pjH8u7_CRThU2VdT1QCXCHd9CugKjCr9Ba24wKGM8gEKJEbwnft764syF1qt-DmnfIoWE3mt71o15F4ln_-EeHldLADA7QeDO1qq7ktVPksqM-f7E2_nfuh6j9DeXDT1sjdYQaOm2hCIQDDuQVBnEDpzXHJcksXqa4WMs4xavsg6jsPccQiy9LJC-MlXUDbTts-hK_4B4IUxvNBv3Z_ZDUPRXIMqQ5gQVyqKTcZzEVRmlqNRr0MlEuY6EJFeyWMcJ33NijTGkD_qSRPBFhrDk4L-wYNdMs1ScIe8xVnjTMD304bS2rTmJkwnlMPdfhip2ill2FxVvFmrGoF-Ds78_XaG84G48Wo2jyeI72q8ytreS6QM18XehLMP25vCp3_AuOUafn
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2011+IEEE+Symposium+on+Business%2C+Engineering+and+Industrial+Applications&rft.atitle=Thermal+comfort+study+in+urban+low-cost+residential+building+in+Shah+Alam&rft.au=Harahap%2C+R.+K.&rft.au=Karim%2C+H.+A.&rft.au=Ahmad%2C+P.&rft.au=Harahap%2C+M.+I.+P.&rft.date=2011-09-01&rft.pub=IEEE&rft.isbn=9781457715488&rft.spage=303&rft.epage=307&rft_id=info:doi/10.1109%2FISBEIA.2011.6088826&rft.externalDocID=6088826
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781457715488/lc.gif&client=summon&freeimage=true
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781457715488/mc.gif&client=summon&freeimage=true
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781457715488/sc.gif&client=summon&freeimage=true