APA (7th ed.) Citation

Lu, H., Rajaguru, P., & Bailey, C. (2018, August). A Numerical Procedure for the Optimization of IGBT Module Packaging. 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 156-160. https://doi.org/10.1109/ICEPT.2018.8480746

Chicago Style (17th ed.) Citation

Lu, Hua, Pushparajah Rajaguru, and Chris Bailey. "A Numerical Procedure for the Optimization of IGBT Module Packaging." 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Aug. 2018: 156-160. https://doi.org/10.1109/ICEPT.2018.8480746.

MLA (9th ed.) Citation

Lu, Hua, et al. "A Numerical Procedure for the Optimization of IGBT Module Packaging." 2018 19th International Conference on Electronic Packaging Technology (ICEPT), Aug. 2018, pp. 156-160, https://doi.org/10.1109/ICEPT.2018.8480746.