A 112.5Gb/s ADC-DSP-Based PAM-4 Long-Reach Transceiver with >50dB Channel Loss in 5nm FinFET
With increasing demand in next-generation data centers and high-performance computing and networking, wireline transceivers are required to operate at 112Gb/s to provide high bandwidth [1]-[3], meanwhile it is necessary to handle >40dB insertion loss to support legacy channels and large package d...
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Published in | Digest of technical papers - IEEE International Solid-State Circuits Conference Vol. 65; pp. 116 - 118 |
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Main Authors | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
20.02.2022
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Subjects | |
Online Access | Get full text |
ISSN | 2376-8606 |
DOI | 10.1109/ISSCC42614.2022.9731650 |
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Abstract | With increasing demand in next-generation data centers and high-performance computing and networking, wireline transceivers are required to operate at 112Gb/s to provide high bandwidth [1]-[3], meanwhile it is necessary to handle >40dB insertion loss to support legacy channels and large package designs [4]. Low-power design is also critical for the integration of multiple transceivers [5]. To advance state-of-the-art design, this work presents an ADC/DAC-DSP based PAM-4 transceiver capable of equalizing >50dB lossy channels and achieving 112.5Gb/s per channel in a 5nm FinFET process with a power efficiency of 4.5pJ/b. |
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AbstractList | With increasing demand in next-generation data centers and high-performance computing and networking, wireline transceivers are required to operate at 112Gb/s to provide high bandwidth [1]-[3], meanwhile it is necessary to handle >40dB insertion loss to support legacy channels and large package designs [4]. Low-power design is also critical for the integration of multiple transceivers [5]. To advance state-of-the-art design, this work presents an ADC/DAC-DSP based PAM-4 transceiver capable of equalizing >50dB lossy channels and achieving 112.5Gb/s per channel in a 5nm FinFET process with a power efficiency of 4.5pJ/b. |
Author | Yoo, M. J. Kollu, S. Liu, P. Hsiao, E. Mostafa, A. Singh, M. Visani, D. Wu, M. Wang, H. Gu, J. Luo, L. Yang, X. Chu, F. Wang, C. Cui, G. Han, X. Elshazly, A. Guo, Z. Zhang, H. Han, C. Adal, Z. Lin, J. Yu, Z. Jiang, L. Huang, Y. Zhao, X. Lu, F. Gambhir, M. Jiang, Z. H. Zhou, D. Wang, B. Ye, T. Hasan, M. Sun, Y. Chen, B. Yan, Z. Zhao, H. |
Author_xml | – sequence: 1 givenname: Z. surname: Guo fullname: Guo, Z. organization: Marvell,Santa Clara,CA – sequence: 2 givenname: A. surname: Mostafa fullname: Mostafa, A. organization: Marvell,Santa Clara,CA – sequence: 3 givenname: A. surname: Elshazly fullname: Elshazly, A. organization: Marvell,Santa Clara,CA – sequence: 4 givenname: B. surname: Chen fullname: Chen, B. organization: Marvell,Santa Clara,CA – sequence: 5 givenname: B. surname: Wang fullname: Wang, B. organization: Marvell,Santa Clara,CA – sequence: 6 givenname: C. surname: Han fullname: Han, C. organization: Marvell,Santa Clara,CA – sequence: 7 givenname: C. surname: Wang fullname: Wang, C. organization: Marvell,Santa Clara,CA – sequence: 8 givenname: D. surname: Zhou fullname: Zhou, D. organization: Marvell,Santa Clara,CA – sequence: 9 givenname: D. surname: Visani fullname: Visani, D. organization: Marvell,Santa Clara,CA – sequence: 10 givenname: E. surname: Hsiao fullname: Hsiao, E. organization: Marvell,Santa Clara,CA – sequence: 11 givenname: F. surname: Chu fullname: Chu, F. organization: Marvell,Santa Clara,CA – sequence: 12 givenname: F. surname: Lu fullname: Lu, F. organization: Marvell,Santa Clara,CA – sequence: 13 givenname: G. surname: Cui fullname: Cui, G. organization: Marvell,Santa Clara,CA – sequence: 14 givenname: H. surname: Zhang fullname: Zhang, H. organization: Marvell,Santa Clara,CA – sequence: 15 givenname: H. surname: Wang fullname: Wang, H. organization: Marvell,Santa Clara,CA – sequence: 16 givenname: H. surname: Zhao fullname: Zhao, H. organization: Marvell,Santa Clara,CA – sequence: 17 givenname: J. surname: Lin fullname: Lin, J. organization: Marvell,Santa Clara,CA – sequence: 18 givenname: J. surname: Gu fullname: Gu, J. organization: Marvell,Santa Clara,CA – sequence: 19 givenname: L. surname: Luo fullname: Luo, L. organization: Marvell,Shanghai,China – sequence: 20 givenname: L. surname: Jiang fullname: Jiang, L. organization: Marvell,Santa Clara,CA – sequence: 21 givenname: M. surname: Singh fullname: Singh, M. organization: Marvell,Santa Clara,CA – sequence: 22 givenname: M. surname: Gambhir fullname: Gambhir, M. organization: Marvell,Santa Clara,CA – sequence: 23 givenname: M. surname: Hasan fullname: Hasan, M. organization: Marvell,Santa Clara,CA – sequence: 24 givenname: M. surname: Wu fullname: Wu, M. organization: Marvell,Santa Clara,CA – sequence: 25 givenname: M. J. surname: Yoo fullname: Yoo, M. J. organization: Marvell,Santa Clara,CA – sequence: 26 givenname: P. surname: Liu fullname: Liu, P. organization: Marvell,Santa Clara,CA – sequence: 27 givenname: S. surname: Kollu fullname: Kollu, S. organization: Marvell,Santa Clara,CA – sequence: 28 givenname: T. surname: Ye fullname: Ye, T. organization: Marvell,Shanghai,China – sequence: 29 givenname: X. surname: Zhao fullname: Zhao, X. organization: Marvell,Shanghai,China – sequence: 30 givenname: X. surname: Yang fullname: Yang, X. organization: Marvell,Santa Clara,CA – sequence: 31 givenname: X. surname: Han fullname: Han, X. organization: Marvell,Santa Clara,CA – sequence: 32 givenname: Y. surname: Huang fullname: Huang, Y. organization: Marvell,Santa Clara,CA – sequence: 33 givenname: Y. surname: Sun fullname: Sun, Y. organization: Marvell,Santa Clara,CA – sequence: 34 givenname: Z. surname: Yu fullname: Yu, Z. organization: Marvell,Santa Clara,CA – sequence: 35 givenname: Z. H. surname: Jiang fullname: Jiang, Z. H. organization: Marvell,Santa Clara,CA – sequence: 36 givenname: Z. surname: Adal fullname: Adal, Z. organization: Marvell,Santa Clara,CA – sequence: 37 givenname: Z. surname: Yan fullname: Yan, Z. organization: Marvell,Santa Clara,CA |
BookMark | eNotkMFOAjEURavRREC-wIX9gQ6v7bTTbkyGQZBkjERYmpDSeSM1UMyUYPx7SWR1k5OTs7h9chMPEQl55JBxDnY0Xy6rKhea55kAITJbSK4VXJGhLQzXWuXCAIhr0hOy0Mxo0Hekn9IXACirTY98lJRzkanZZpRoOanYZLlgY5ewoYvyleW0PsRP9o7Ob-mqczF5DCfs6E84bumTgmZMq62LEXdnMyUaIlVxT6chTp9X9-S2dbuEw8sOyOpMqxdWv83mVVmzYOHIdMtbFLy1rbFaKWeN90VuGgfSAjTaeovYOClRFNJjq6VvwHC-ydXGgbNyQB7-swER199d2Lvud335Qv4BHXFRcQ |
ContentType | Conference Proceeding |
DBID | 6IE 6IH CBEJK RIE RIO |
DOI | 10.1109/ISSCC42614.2022.9731650 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan (POP) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library (IEL) IEEE Proceedings Order Plans (POP) 1998-present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Xplore url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISBN | 9781665428002 1665428007 |
EISSN | 2376-8606 |
EndPage | 118 |
ExternalDocumentID | 9731650 |
Genre | orig-research |
GroupedDBID | 6IE 6IF 6IH 6IK 6IL 6IM 6IN AAJGR AAWTH ABLEC ACGFS ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IEGSK IJVOP IPLJI M43 OCL RIE RIL RIO RNS |
ID | FETCH-LOGICAL-i90t-6f1fe21f9f89655a98cc748da03900d69c9eeda33e273cef63cd0811b45ba0a93 |
IEDL.DBID | RIE |
IngestDate | Wed Aug 27 02:47:41 EDT 2025 |
IsPeerReviewed | false |
IsScholarly | true |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i90t-6f1fe21f9f89655a98cc748da03900d69c9eeda33e273cef63cd0811b45ba0a93 |
PageCount | 3 |
ParticipantIDs | ieee_primary_9731650 |
PublicationCentury | 2000 |
PublicationDate | 2022-Feb.-20 |
PublicationDateYYYYMMDD | 2022-02-20 |
PublicationDate_xml | – month: 02 year: 2022 text: 2022-Feb.-20 day: 20 |
PublicationDecade | 2020 |
PublicationTitle | Digest of technical papers - IEEE International Solid-State Circuits Conference |
PublicationTitleAbbrev | ISSCC |
PublicationYear | 2022 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0005968 |
Score | 2.4191952 |
Snippet | With increasing demand in next-generation data centers and high-performance computing and networking, wireline transceivers are required to operate at 112Gb/s... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 116 |
SubjectTerms | Bandwidth Conferences Data centers FinFETs Insertion loss Next generation networking Transceivers |
Title | A 112.5Gb/s ADC-DSP-Based PAM-4 Long-Reach Transceiver with >50dB Channel Loss in 5nm FinFET |
URI | https://ieeexplore.ieee.org/document/9731650 |
Volume | 65 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NS8MwGA5zJ734sYnf5ODRdOlH0uYibJ1zipPhJuwgjCRNZKiZuO7irzdpq1Px4KWE0tCQUJ73ffo87wvAaWIzHa1ijnhMMsdWUcRxoBC3H3nCOOEllT24pf376HpCJjVw9uWFUUoV4jPluWHxLz-by6WjylpFmyWXoK_FMSu9Wis5B6NJpd_yMWtdjUZp6tIDx5sEgVdN_dFDpYCQ3iYYfL68VI48ectcePL9V13G_65uCzRXZj04_IKhbVBTZgdsfKsz2AAPbWgDHo9citYCtrsp6o6GqGPxK4PD9gBF8GZuHtGdE1bCArykcnIN6EhaeE5w1oHOhWDUs31ysYAzA4l5gb2Z6V2Mm2Bsr2kfVW0V0IzhHFHtaxX4mumEUUI4S6SMoyTjOGQYZ5RJZhfMw1DZyEYqTUOZ2bjBFxERHHMW7oK6mRu1B2BMGdM8EljYpE75MeexYFGouSuUZuOcfdBw2zR9LQtnTKsdOvj79iFYd0dV-MXxEajnb0t1bBE_FyfFUX8AtEKm3Q |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NT8IwGG4MHtSLH2D8tgePdnQf3daLCQwRlBEimHAwIe3WGqIWI-Pir7fdJqjx4GVpljVr2izP-zx73vcF4CLUTEeKgCEWkNSoVT5i2BGI6Y88pIywQsqO-37nwbsdk_EauFzmwgghcvOZsMww_5efzpKFkcrqeZslQ9DXiWYVQZGttTJ0UD8sHVw2pvXucBhFhiAY5cRxrHLyjy4qOYi0t0H89frCO_JsLTJuJR-_KjP-d307oLZK14ODJRDtgjWh9sDWt0qDVfDYgDrkscgNr89hoxWh1nCAmhrBUjhoxMiDvZl6QvfGWglz-EqEMWxAI9PCK4LTJjR5CEq86CfnczhVkKhX2J6q9vWoBkb6GnVQ2VgBTSnOkC9tKRxbUhlSnxBGwyQJvDBl2KUYpz5NqF4wc12hY5tESN9NUh052NwjnGFG3X1QUTMlDgAMfEol8zjmmtYJO2As4NRzJTOl0nSkcwiqZpsmb0XpjEm5Q0d_3z4HG51R3Jv0uv27Y7Bpji3PHscnoJK9L8Spxv-Mn-XH_gmvIqou |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Digest+of+technical+papers+-+IEEE+International+Solid-State+Circuits+Conference&rft.atitle=A+112.5Gb%2Fs+ADC-DSP-Based+PAM-4+Long-Reach+Transceiver+with+%3E50dB+Channel+Loss+in+5nm+FinFET&rft.au=Guo%2C+Z.&rft.au=Mostafa%2C+A.&rft.au=Elshazly%2C+A.&rft.au=Chen%2C+B.&rft.date=2022-02-20&rft.pub=IEEE&rft.eissn=2376-8606&rft.volume=65&rft.spage=116&rft.epage=118&rft_id=info:doi/10.1109%2FISSCC42614.2022.9731650&rft.externalDocID=9731650 |