Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure - Sakata, A.; Yamada, M.; Hasunuma, M.; Takahashi, S.; Yamada, A.; Hasegawa, T.; Kaneko, H.; Yamashita, S.; Omoto, S.; Hatano, M.; Wada, J.; Higashi, K.; et al. (Proceedings of the IEEE International Interconnect Technology Conference, 2006)
Keywords: Costs; Electric resistance; Electromigration; Grain boundaries; Inorganic materials; Intermetallic; Moisture control; Phase change materials; Stress; Titanium