APA (7th ed.) Citation

Sakata, A., Yamada, M., Hasunuma, M., Takahashi, S., Yamada, A., Hasegawa, T., . . . Imamizu, K. (2006). Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure. Proceedings of the IEEE International Interconnect Technology Conference, 101-104. https://doi.org/10.1109/IITC.2006.1648658

Chicago Style (17th ed.) Citation

Sakata, A., et al. "Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure." Proceedings of the IEEE International Interconnect Technology Conference 2006: 101-104. https://doi.org/10.1109/IITC.2006.1648658.

MLA (9th ed.) Citation

Sakata, A., et al. "Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure." Proceedings of the IEEE International Interconnect Technology Conference, 2006, pp. 101-104, https://doi.org/10.1109/IITC.2006.1648658.