Breakthrough Integration of 32nm-node CulCntra Low-k SiOC (k=2.0) Interconnects by using Advanced Pore-Sealing and Low-k Hard Mask Technologies - Arakawa, S.; Mizuno, I.; Ohoka, Y.; Nagahata, K.; Tabuchi, K.; Kanamura, R.; Kadomura, S. (Proceedings of the IEEE International Interconnect Technology Conference, 2006)
Keywords: Capacitance; Etching; Moisture; Plasma properties; Polymer films; Prognostics and health management; Protection; Samarium; Stress; Thermal degradation