UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials - Nakao, S.-I.; Ushio, J.; Ohno, T.; Hamada, T.; Kamigaki, Y.; Kato, M.; Yoneda, K.; Kondo, S.; Kobayashi, N. (Proceedings of the IEEE International Interconnect Technology Conference, 2006)
Keywords: Chemical analysis; Curing; Dielectric constant; Dielectric materials; Lead compounds; Materials science and technology; Moisture; Optical films; Paramagnetic resonance; Semiconductor materials