Cu Alloy Metallization for Self-Forming Barrier Process - Koike, J.; Haneda, M.; Iijima, J.; Wada, M. (Proceedings of the IEEE International Interconnect Technology Conference, 2006)
Keywords: Alloying; Amorphous materials; Atherosclerosis; Chemical elements; Conductivity; Copper alloys; Dielectrics; Electrons; Materials science and technology; Metallization