Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-...

Full description

Saved in:
Bibliographic Details
Published inProceedings of the IEEE International Interconnect Technology Conference pp. 230 - 232
Main Authors Sato, S., Nihei, M., Mimura, A., Kawabata, A., Kondo, D., Shioya, H., Iwai, T., Mishima, M., Ohfuti, M., Awano, Y.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2006
Subjects
Carbon nanotubes
Ceramics
Current density
Dielectric substrates
Electric resistance
Laboratories
Nanoparticles
Nanotechnology
Tin
Wiring
Online AccessGet full text
ISBN1424401046
9781424401048
ISSN2380-632X
DOI10.1109/IITC.2006.1648696

Cover

More Information
Summary:We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Omega for 2-mum vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst
ISBN:1424401046
9781424401048
ISSN:2380-632X
DOI:10.1109/IITC.2006.1648696