Ultra large pitch and depth structures metrology using spectral reflectometry in combination with RCWA based model and TLM Algorithm : AM: Advanced Metrology - Vito, Annalisa Del; Osherov, Ilya; Urbanowicz, Adam Michal; Katz, Yinon; Barkan, Kobi; Turovets, Igor; Haupt, Ronny (ASMC proceedings, 2020)
Keywords: deep trench; Hardware; large pitch; Metrology; OCD; Optical reflection; Optical scattering; Radar measurements; RCWA limits; scatterometry; Semiconductor device measurement; Silicon