Significant enhancement in stability of copper nanowires network deposited by alumina via atomic layer deposition for transparent electromagnetic interference shielding - Cheng, Kuifu; Liang, Xianwen; Zhao, Tao; Liu, Dan; Lai, Zhiqiang; Fu, Xianzhu; Sun, Rong (2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022)
Keywords: Alumina; Atomic layer deposition; Copper; Copper nanowires; Electromagnetic interference; Humidity; Indium tin oxide; Nanowires; Plasmas; Stability; Surface resistance