Hardware Acceleration of Aggregate Signature Generation and Authentication by BLS Signature over BLS12-381 curve

BLS signature is a digital signature scheme computed over elliptic curves, and it has been attracting attention with its interesting function that signatures can be aggregated. We will introduce our progress of designing two ASIC architectures to accelerate the complex computations of generating and...

Full description

Saved in:
Bibliographic Details
Published inProceedings for IEEE COOL Chips (Online) pp. 1 - 3
Main Authors Masada, Kaoru, Nakayama, Ryohei, Ikeda, Makoto
Format Conference Proceeding
LanguageEnglish
Published IEEE 20.04.2022
Subjects
Online AccessGet full text
ISSN2473-4683
DOI10.1109/COOLCHIPS54332.2022.9772706

Cover

Abstract BLS signature is a digital signature scheme computed over elliptic curves, and it has been attracting attention with its interesting function that signatures can be aggregated. We will introduce our progress of designing two ASIC architectures to accelerate the complex computations of generating and verifying signatures respectively. The computations include mapping to elliptic curves and pairing. An important subject of our work is to adopt a relatively new curve called BLS12-381. BLS12-381 is currently one of the curves that gather the most interests and yet very few ASIC implementations are optimized for BLS12-381.
AbstractList BLS signature is a digital signature scheme computed over elliptic curves, and it has been attracting attention with its interesting function that signatures can be aggregated. We will introduce our progress of designing two ASIC architectures to accelerate the complex computations of generating and verifying signatures respectively. The computations include mapping to elliptic curves and pairing. An important subject of our work is to adopt a relatively new curve called BLS12-381. BLS12-381 is currently one of the curves that gather the most interests and yet very few ASIC implementations are optimized for BLS12-381.
Author Nakayama, Ryohei
Ikeda, Makoto
Masada, Kaoru
Author_xml – sequence: 1
  givenname: Kaoru
  surname: Masada
  fullname: Masada, Kaoru
  email: masada@silicon.u-tokyo.ac.jp
– sequence: 2
  givenname: Ryohei
  surname: Nakayama
  fullname: Nakayama, Ryohei
  email: nakayama@silicon.u-tokyo.ac.jp
– sequence: 3
  givenname: Makoto
  surname: Ikeda
  fullname: Ikeda, Makoto
  email: ikeda@silicon.u-tokyo.ac.jp
  organization: The University of Tokyo,Tokyo,Japan,113-8654
BookMark eNpNkM1KAzEYRaMoWGufwE3A9dR8SSY_y3GwPzBQobouafLNOFIzJZ1W-vYqreDqwuFwFveWXMUuIiEPwMYAzD6Wi0VVzuYvy1wKwceccT62WnPN1AUZWW1AqVyCNTa_JAMutcikMuKGjHa7D8aYAMsYFwOynbkUvlxCWniPG0yub7tIu5oWTZOwcT3SZdtE1-9_nCnGP8PFQIt9_46xb_0JrY_0qVr-07sDpl8EPBMGqN-nA96R69ptdjg675C8TZ5fy1lWLabzsqiyFqztMy8YMqmDUeAgIA-gg0TrOEi-lryujbZSS-3AcpWjUFyDh1r7gHIdpBFDcn_qtoi42qb206Xj6vyR-AYVFl5B
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/COOLCHIPS54332.2022.9772706
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
Accès UT - IEEE Xplore POP ALL
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Xplore Digital Library (LUT)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISBN 9781665419895
166541989X
EISSN 2473-4683
EndPage 3
ExternalDocumentID 9772706
Genre orig-research
GroupedDBID 6IE
6IF
6IL
6IN
AAJGR
AAWTH
ABLEC
ADZIZ
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
CHZPO
IEGSK
OCL
RIE
RIL
ID FETCH-LOGICAL-i199t-c30e047d861a1de2d17d4e9a2142b42ff8794747a19265e36271c1f7cde4bd483
IEDL.DBID RIE
IngestDate Wed Aug 27 02:24:05 EDT 2025
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i199t-c30e047d861a1de2d17d4e9a2142b42ff8794747a19265e36271c1f7cde4bd483
PageCount 3
ParticipantIDs ieee_primary_9772706
PublicationCentury 2000
PublicationDate 2022-04-20
PublicationDateYYYYMMDD 2022-04-20
PublicationDate_xml – month: 04
  year: 2022
  text: 2022-04-20
  day: 20
PublicationDecade 2020
PublicationTitle Proceedings for IEEE COOL Chips (Online)
PublicationTitleAbbrev COOL CHIPS
PublicationYear 2022
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0003190023
Score 1.8093672
Snippet BLS signature is a digital signature scheme computed over elliptic curves, and it has been attracting attention with its interesting function that signatures...
SourceID ieee
SourceType Publisher
StartPage 1
SubjectTerms Authentication
BLS signature
BLS12-381
Computer architecture
cryptography
Elliptic curve cryptography
Elliptic curves
Generators
mappings
pairing
Power demand
Software
Title Hardware Acceleration of Aggregate Signature Generation and Authentication by BLS Signature over BLS12-381 curve
URI https://ieeexplore.ieee.org/document/9772706
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjZ1JSwMxFIBD7UH04tKKOwE9OtNZMtuxFkuVagu10FvJ8lKKMC1lRtFfb97MWKt48DaE8AhJhrd_IeQ6YMrYATK0NHe4xZQWFk9AW9wTmkWh0IksaJ9PYW_MHibBpEZu1r0wAFAUn4GNn0UuXy1kjqGylrFVvAj52ltRHJa9Wut4irlKqH-2yVWF0Wx1BoN-p3c_HAXI6DKuoOfZlYQfT6kUmqS7Rx6_1lAWkLzYeSZs-fELz_jfRe6T5nfPHh2utdEBqUF6SHY3cIMNssQ0_RtfAW1LadRNefh0oWl7ZtxuDKjR0XxWsj5pCaQuZvBUUYylYWVRGeKj4p3e9kcb07EUFIeQThi7VOarV2iScffuudOzqhcXrLmbJJklfQccFqk4dLmrwFNupBgkHLlsgnlax-b3NQ4IN3ZhGIBRfpErXR1JBUwoFvtHpJ4uUjgm1BHcmC4QBsi_CZJQ-L6RZgT42rhQMj4hDdy76bKEakyrbTv9e_iM7OD5YRrHc85JPVvlcGGsgUxcFtfgExjHtB0
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjZ3ZS8MwGMDDUPB48djE24A-2q1Hej3O4ei0O2Ab7G3kHEPoxmgV_evN19Y5xQffSggfIUn57l8QunOJ0HYA9wxFTWoQoZhBQ6kMajNFfI-pkOe0z54XjcnTxJ1U0P26F0ZKmRefyTp85rl8seAZhMoa2laxfeBrb7uEELfo1lpHVPRlAg20g25LkGaj1e_HragzGLpA6dLOoG3XSxk_HlPJdUn7AHW_VlGUkLzUs5TV-ccvQON_l3mIat9de3iw1kdHqCKTY7S_ARysoiUk6t_oSuIm51rhFMePFwo3Z9rxhpAaHs5nBe0TF0jqfAZNBIZoGtQWFUE-zN7xQzzcmA7FoDAEfMLAwjxbvcoaGrcfR63IKN9cMOZWGKYGd0xpEl8EnkUtIW1h-YLIkAKZjRFbqUD_wNoFodoy9Fyp1Z9vcUv5XEjCBAmcE7SVLBJ5irDJqDZepOcCAccNPeY4WpoW4CjtRPHgDFVh76bLAqsxLbft_O_hG7QbjbrxNO70ni_QHpwlJHVs8xJtpatMXmnbIGXX-ZX4BLcIt2o
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+for+IEEE+COOL+Chips+%28Online%29&rft.atitle=Hardware+Acceleration+of+Aggregate+Signature+Generation+and+Authentication+by+BLS+Signature+over+BLS12-381+curve&rft.au=Masada%2C+Kaoru&rft.au=Nakayama%2C+Ryohei&rft.au=Ikeda%2C+Makoto&rft.date=2022-04-20&rft.pub=IEEE&rft.eissn=2473-4683&rft.spage=1&rft.epage=3&rft_id=info:doi/10.1109%2FCOOLCHIPS54332.2022.9772706&rft.externalDocID=9772706