Toward predictive modeling of full-size packages with layered-medium integral-equation methods

• Published in: IEEE ... Conference on Electrical Performance of Electronic Packaging and Systems (Print) pp. 183 - 186
• Main Authors: Liu, C., Menshov, A., Subramanian, V., Aygun, K., Braunisch, H., Okhmatovski, V. I., Yilmaz, A. E.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.10.2016
• Subjects: Computational modeling; Conductors; fast algorithms; integral-equation methods; layered media; Mathematical model; multiscale analysis; Ports (Computers); Rough surfaces; Surface impedance; Surface roughness
• ISSN: 2165-4115
• DOI: 10.1109/EPEPS.2016.7835446

Layered-medium integral-equation (LMIE) methods that can confront the multiscale problems encountered in electromagnetic modeling of electronic packages are presented. The methods include (i) an impedance-boundary condition (IBC) formulation for modeling conductor thickness, roughness, and finite conductivity, (ii) non-radiating lumped-port models for extracting network parameters, and (iii) FFT based iterative and hierarchical-matrix (ℋ-matrix) based direct algorithms for efficiently solving the resulting systems of equations. The methods are used to analyze increasingly higher fidelity models of a benchmark packaging interconnect structure; the results are validated with measurements; and the tradeoff between increased model fidelity and computational costs are quantified.