APA (7th ed.) Citation

Liu, C., Menshov, A., Subramanian, V., Aygun, K., Braunisch, H., Okhmatovski, V. I., & Yilmaz, A. E. (2016, October). Toward predictive modeling of full-size packages with layered-medium integral-equation methods. IEEE ... Conference on Electrical Performance of Electronic Packaging and Systems (Print), 183-186. https://doi.org/10.1109/EPEPS.2016.7835446

Chicago Style (17th ed.) Citation

Liu, C., A. Menshov, V. Subramanian, K. Aygun, H. Braunisch, V. I. Okhmatovski, and A. E. Yilmaz. "Toward Predictive Modeling of Full-size Packages with Layered-medium Integral-equation Methods." IEEE ... Conference on Electrical Performance of Electronic Packaging and Systems (Print) Oct. 2016: 183-186. https://doi.org/10.1109/EPEPS.2016.7835446.

MLA (9th ed.) Citation

Liu, C., et al. "Toward Predictive Modeling of Full-size Packages with Layered-medium Integral-equation Methods." IEEE ... Conference on Electrical Performance of Electronic Packaging and Systems (Print), Oct. 2016, pp. 183-186, https://doi.org/10.1109/EPEPS.2016.7835446.