A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions - Heaslip, G.M.; Punch, J.M.; Rodgers, B.A.; Ryan, C.; Reid, M. (2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems, 2005)
Keywords: Circuit testing; Electric shock; Electronic components; Electronics packaging; Environmentally friendly manufacturing techniques; Failure analysis; Integrated circuit interconnections; Lead; Scanning electron microscopy; Strain measurement