APA (7th ed.) Citation

Heaslip, G., Punch, J., Rodgers, B., Ryan, C., & Reid, M. (2005). A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions. 2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems, 277-284. https://doi.org/10.1109/ESIME.2005.1502814

Chicago Style (17th ed.) Citation

Heaslip, G.M, J.M Punch, B.A Rodgers, C. Ryan, and M. Reid. "A Stress-life Methodology for Ball Grid Array Lead-free and Tin-lead Solder Interconnects Under Impact Conditions." 2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems 2005: 277-284. https://doi.org/10.1109/ESIME.2005.1502814.

MLA (9th ed.) Citation

Heaslip, G.M, et al. "A Stress-life Methodology for Ball Grid Array Lead-free and Tin-lead Solder Interconnects Under Impact Conditions." 2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems, 2005, pp. 277-284, https://doi.org/10.1109/ESIME.2005.1502814.