APA (7th ed.) Citation

Richter, H., Rempp, H., Hassan, M., Harendt, C., Wacker, N., Zimmermann, M., & Burghartz, J. (2009, May). Technology and design aspects of ultra-thin silicon chips for bendable electronics. 2009 IEEE International Conference on IC Design and Technology, 149-154. https://doi.org/10.1109/ICICDT.2009.5166284

Chicago Style (17th ed.) Citation

Richter, H., H.D Rempp, M.-U Hassan, C. Harendt, N. Wacker, M. Zimmermann, and J.N Burghartz. "Technology and Design Aspects of Ultra-thin Silicon Chips for Bendable Electronics." 2009 IEEE International Conference on IC Design and Technology May. 2009: 149-154. https://doi.org/10.1109/ICICDT.2009.5166284.

MLA (9th ed.) Citation

Richter, H., et al. "Technology and Design Aspects of Ultra-thin Silicon Chips for Bendable Electronics." 2009 IEEE International Conference on IC Design and Technology, May. 2009, pp. 149-154, https://doi.org/10.1109/ICICDT.2009.5166284.