Manufacturable Low Keff (Keff<2.5) Cu Interconnects by Selective / Low Damage Air Gap Formation - Harada, T.; Takahashi, M.; Murakami, K.; Korogi, H.; Sasaki, T.; Hattori, T.; Ogawa, S.; Ueda, T. (Proceedings of the IEEE International Interconnect Technology Conference, 2006)
Keywords: Air gaps; Degradation; Dielectrics; Integrated circuit interconnections; Manufacturing; Resists; Silicon compounds; Space technology; Ultra large scale integration; Wet etching