APA (7th ed.) Citation

Dao, T., Triyoso, D., Petras, M., & Canonico, M. (2009, May). Through Silicon Via stress characterization. 2009 IEEE International Conference on IC Design and Technology, 39-41. https://doi.org/10.1109/ICICDT.2009.5166260

Chicago Style (17th ed.) Citation

Dao, Thuy, D.H Triyoso, M. Petras, and M. Canonico. "Through Silicon Via Stress Characterization." 2009 IEEE International Conference on IC Design and Technology May. 2009: 39-41. https://doi.org/10.1109/ICICDT.2009.5166260.

MLA (9th ed.) Citation

Dao, Thuy, et al. "Through Silicon Via Stress Characterization." 2009 IEEE International Conference on IC Design and Technology, May. 2009, pp. 39-41, https://doi.org/10.1109/ICICDT.2009.5166260.