Cobalt fill for advanced interconnects - Bekiaris, Nikolaos; Zhiyuan Wu; Ren, He; Naik, Mehul; Jin Hee Park; Lee, Mark; Tae Hong Ha; Wenting Hou; Bakke, Jonathan R.; Gage, Max; You Wang; Jianshe Tang (Proceedings of the IEEE International Interconnect Technology Conference, 2017)
Keywords: Annealing; Cobalt; Conductivity; gap fill; interconnect; middle of line (MOL); Reliability; reliability back end of line (BEOL); resistivity; Tin; Wires