Co-design of Thermal Management with System Architecture and Power Management for 3D ICs - Roy, Rishav; Das, Shidhartha; Labbe, Benoit; Mathur, Rahul; Jeloka, Supreet (Proceedings / Electronic Components Conference, 2022)
Keywords: 3D ICs; Cooling; Electronic packaging thermal management; power management; Power system management; Power system measurements; Stacking; Systems architecture; thermal management; Three-dimensional displays