Impact of Redundancy and Line Extension on Short-Length Effect in Electromigration Reliability
This study investigates electromigration in a double-redundancy interconnect configuration, commonly found at standard-cell level in the power delivery networks, under downstream electron flow conditions, using both experiments and physics-based simulations. This work sheds light on the critical jL...
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| Published in | Proceedings of the IEEE International Interconnect Technology Conference pp. 1 - 3 |
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| Main Authors | , , , , , |
| Format | Conference Proceeding |
| Language | English |
| Published |
IEEE
02.06.2025
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| Subjects | |
| Online Access | Get full text |
| ISSN | 2380-6338 |
| DOI | 10.1109/IITC66087.2025.11075449 |
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| Abstract | This study investigates electromigration in a double-redundancy interconnect configuration, commonly found at standard-cell level in the power delivery networks, under downstream electron flow conditions, using both experiments and physics-based simulations. This work sheds light on the critical jL product, (jL) c , in presence of a parallel path. Due to double redundancy, for our samples coming from a 28nm commercial technology node, the critical current density j c was found to increase by 1.15-fold and 1.1-fold, for 5% and 20% R-shift failure criteria, respectively. The impact of line extension on (jL) c was also investigated. A 37% decrease in (jL) c was observed for a single line with a passive line extension acting as a sink, undermining the short-length effect, regardless of the failure criterion. For the same target lifetime, a 1.2-fold increase in maximum allowable current density, based on a 50% target failure percentile and 10 years lifetime criterion, was obtained when comparing the single and double redundancy configurations for 5% R-shift. |
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| AbstractList | This study investigates electromigration in a double-redundancy interconnect configuration, commonly found at standard-cell level in the power delivery networks, under downstream electron flow conditions, using both experiments and physics-based simulations. This work sheds light on the critical jL product, (jL) c , in presence of a parallel path. Due to double redundancy, for our samples coming from a 28nm commercial technology node, the critical current density j c was found to increase by 1.15-fold and 1.1-fold, for 5% and 20% R-shift failure criteria, respectively. The impact of line extension on (jL) c was also investigated. A 37% decrease in (jL) c was observed for a single line with a passive line extension acting as a sink, undermining the short-length effect, regardless of the failure criterion. For the same target lifetime, a 1.2-fold increase in maximum allowable current density, based on a 50% target failure percentile and 10 years lifetime criterion, was obtained when comparing the single and double redundancy configurations for 5% R-shift. |
| Author | Milojevic, Dragomir Esposto, Simone Zahedmanesh, Houman Ciofi, Ivan Croes, Kristof Sisto, Giuliano |
| Author_xml | – sequence: 1 givenname: Simone surname: Esposto fullname: Esposto, Simone email: simone.esposto@imec.be organization: Imec,Leuven,Belgium – sequence: 2 givenname: Ivan surname: Ciofi fullname: Ciofi, Ivan organization: Imec,Leuven,Belgium – sequence: 3 givenname: Giuliano surname: Sisto fullname: Sisto, Giuliano organization: Imec,Leuven,Belgium – sequence: 4 givenname: Kristof surname: Croes fullname: Croes, Kristof organization: Imec,Leuven,Belgium – sequence: 5 givenname: Dragomir surname: Milojevic fullname: Milojevic, Dragomir organization: Imec,Leuven,Belgium – sequence: 6 givenname: Houman surname: Zahedmanesh fullname: Zahedmanesh, Houman organization: Imec,Leuven,Belgium |
| BookMark | eNo1UNtKw0AUXEXBtvYPBPcHUvd-eZQSNRAQan21bLJn25VkU5II9u9NUWFghmHmcJg5ukpdAoTuKVlRSuxDUWzXShGjV4wwefa0FMJeoKXV1nBOJdeGiks0Y9yQTHFubtB8GD4JYYQKPkMfRXt09Yi7gDfgv5J3qT5hlzwuYwKcf4-QhtglPOHt0PVjVkLajwechwBTLyacN5PouzbuezeeoxtooqtiE8fTLboOrhlg-ccL9P6Ub9cvWfn6XKwfyyxSZmmmvFFaV5JJUxlGHJ9UracXrRAauK0EMEqDlcIrH5wMQJhQVFQenGK85gt093s3AsDu2MfW9afd_x78B_ZpVoQ |
| ContentType | Conference Proceeding |
| DBID | 6IE 6IL CBEJK RIE RIL |
| DOI | 10.1109/IITC66087.2025.11075449 |
| DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Xplore POP ALL IEEE Xplore All Conference Proceedings IEEE Electronic Library (IEL) IEEE Proceedings Order Plans (POP All) 1998-Present |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISBN | 9798331537814 |
| EISSN | 2380-6338 |
| EndPage | 3 |
| ExternalDocumentID | 11075449 |
| Genre | orig-research |
| GroupedDBID | 6IE 6IF 6IK 6IL 6IN AAJGR AAWTH ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IPLJI M43 OCL RIE RIL |
| ID | FETCH-LOGICAL-i1291-6d8677b5258b820a3525c72019447e39b4e211f954d6dfa5fe024614bdea623c3 |
| IEDL.DBID | RIE |
| IngestDate | Wed Aug 27 02:14:11 EDT 2025 |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-i1291-6d8677b5258b820a3525c72019447e39b4e211f954d6dfa5fe024614bdea623c3 |
| PageCount | 3 |
| ParticipantIDs | ieee_primary_11075449 |
| PublicationCentury | 2000 |
| PublicationDate | 2025-June-2 |
| PublicationDateYYYYMMDD | 2025-06-02 |
| PublicationDate_xml | – month: 06 year: 2025 text: 2025-June-2 day: 02 |
| PublicationDecade | 2020 |
| PublicationTitle | Proceedings of the IEEE International Interconnect Technology Conference |
| PublicationTitleAbbrev | IITC |
| PublicationYear | 2025 |
| Publisher | IEEE |
| Publisher_xml | – name: IEEE |
| SSID | ssj0020143 |
| Score | 1.9134852 |
| Snippet | This study investigates electromigration in a double-redundancy interconnect configuration, commonly found at standard-cell level in the power delivery... |
| SourceID | ieee |
| SourceType | Publisher |
| StartPage | 1 |
| SubjectTerms | Electromigration parallel system PDN redundancy power delivery network short-length effect |
| Title | Impact of Redundancy and Line Extension on Short-Length Effect in Electromigration Reliability |
| URI | https://ieeexplore.ieee.org/document/11075449 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3JasMwEBVNTu2lW0p3dOhVjhct1jkkJKWE0iaQU4Mkj5NQaofiQNuvryQn6QKFgg_GIGxGZmae_d4bhG6Epm5-DyeQSkaoViFRKpaE2nSZRDwGozzLd8j7Y3o7YZO1WN1rYQDAk88gcKf-X35WmpX7VNZ2WIVRKhuoIVJei7W26MoZ1a0JXFEo24PBqMN5mAqLAWMWbJb-GKLia0hvHw03d6-pI8_BqtKB-fhlzPjvxztArS-5Hr7fFqJDtAPFEdr75jR4jJ4GXg2Jyxw_gBOOuaSKVZFhC0YBd988kb0ssD0e57YlJ3dQzKo5rt2N8aLA3XpgzstiVr802LGZa5fv9xYa97qjTp-sRyuQhS3wEeGZ87HTLGaptj2AcqaoRtgYSkoFJFJTsMgwl4xmPMsVyyF0xnNUZ6Bsw2SSE9QsygJOEc4jqdIc7AoAKsNEJcLmTE6FQ47GyDPUcqGaLmv3jOkmSud_XL9Au27HPB0rvkTN6nUFV7bwV_rab_gnHhGsiA |
| linkProvider | IEEE |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1bS8MwFA46H9QXbxPv5sHXdL0kafM8NladQ3SDPTmS9nQbYivSgvrrTdJtXkAQCi2F0HJSTs7XfN93ELoKFTX9eziBSDBClXSJlL4gVKfLwOM-JNKyfAe8N6LXYzZeiNWtFgYALPkMHHNp9_LTIqnMr7KWwSqMUrGONvSJslqutcJXxqpuQeHyXNGK42GbczcKNQr0mbMc_KONil1FujtosHx-TR55cqpSOcnHL2vGf7_gLmp-Cfbw3Wop2kNrkO-j7W9egwfoMbZ6SFxk-B6MdMykVSzzFGs4CrjzZqnsRY718TDTRTnpQz4tZ7j2N8bzHHfqljnP82n92WDDZ659vt-baNTtDNs9smiuQOZ6ifcIT42TnWI-i5SuAqSxRU1CHUNBaQiBUBQ0NswEoylPM8kycI31HFUpSF0yJcEhauRFDkcIZ56QUQZ6BAAVbiCDUGdNTkODHZNEHKOmCdXkpfbPmCyjdPLH_Uu02Rve9if9eHBzirbM7Flyln-GGuVrBee6DCjVhZ38T1XSr9U |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+the+IEEE+International+Interconnect+Technology+Conference&rft.atitle=Impact+of+Redundancy+and+Line+Extension+on+Short-Length+Effect+in+Electromigration+Reliability&rft.au=Esposto%2C+Simone&rft.au=Ciofi%2C+Ivan&rft.au=Sisto%2C+Giuliano&rft.au=Croes%2C+Kristof&rft.date=2025-06-02&rft.pub=IEEE&rft.eissn=2380-6338&rft.spage=1&rft.epage=3&rft_id=info:doi/10.1109%2FIITC66087.2025.11075449&rft.externalDocID=11075449 |