Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling - Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Gunther, M.; Haag, M. (2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015)
Keywords: Bonding; Insulated gate bipolar transistors; Resistance heating; Silver; Stress; Substrates