APA (7th ed.) Citation

Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Gunther, M., & Haag, M. (2015, April). Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling. 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 1-8. https://doi.org/10.1109/EuroSimE.2015.7103139

Chicago Style (17th ed.) Citation

Dudek, R., R. Doring, S. Rzepka, C. Ehrhardt, M. Gunther, and M. Haag. "Electro-thermo-mechanical Analyses on Silver Sintered IGBT-module Reliability in Power Cycling." 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Apr. 2015: 1-8. https://doi.org/10.1109/EuroSimE.2015.7103139.

MLA (9th ed.) Citation

Dudek, R., et al. "Electro-thermo-mechanical Analyses on Silver Sintered IGBT-module Reliability in Power Cycling." 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr. 2015, pp. 1-8, https://doi.org/10.1109/EuroSimE.2015.7103139.