APA (7th ed.) Citation

Sanchez, N., Chen, K., Chen, C., McMahill, D., Hwang, S., Lutsky, J., . . . Rothberg, J. M. (2021). 34.1 An 8960-Element Ultrasound-on-Chip for Point-of-Care Ultrasound. Digest of technical papers - IEEE International Solid-State Circuits Conference, 64, 480-482. https://doi.org/10.1109/ISSCC42613.2021.9365808

Chicago Style (17th ed.) Citation

Sanchez, Nevada, et al. "34.1 An 8960-Element Ultrasound-on-Chip for Point-of-Care Ultrasound." Digest of Technical Papers - IEEE International Solid-State Circuits Conference 64 (2021): 480-482. https://doi.org/10.1109/ISSCC42613.2021.9365808.

MLA (9th ed.) Citation

Sanchez, Nevada, et al. "34.1 An 8960-Element Ultrasound-on-Chip for Point-of-Care Ultrasound." Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 64, 2021, pp. 480-482, https://doi.org/10.1109/ISSCC42613.2021.9365808.