Suppression of H2O absorption by hydrophobic-like surface of SiOx without Si-OH group

A mechanism of H 2 O absorption into SiO x films for forming hydrophobic surfaces is experimentally studied with annealing at several temperatures followed by exposure to several environment conditions. A key requisite to suppress H 2 O absorption was found to be a hydrophobic-like surface of SiO x...

Full description

Saved in:
Bibliographic Details
Published inProceedings of the IEEE International Interconnect Technology Conference pp. 100 - 102
Main Authors Ueda, Tetsuya, Kiso, Osamu, Abe, Shoji, Takezawa, Yasunari, Matsumaro, Kazuyuki, Suzuki, Chikashi, Toyama, Munehiro, Ogawa, Shinichi
Format Conference Proceeding
LanguageEnglish
Japanese
Published IEEE 05.10.2020
Subjects
Online AccessGet full text
ISSN2380-6338
DOI10.1109/IITC47697.2020.9515669

Cover

Abstract A mechanism of H 2 O absorption into SiO x films for forming hydrophobic surfaces is experimentally studied with annealing at several temperatures followed by exposure to several environment conditions. A key requisite to suppress H 2 O absorption was found to be a hydrophobic-like surface of SiO x , which was formed by annealing above 700°C, which completely removes the Si-OH group. This result indicates the possibility to fabricate the completed SiO x films that almost prevent H 2 O absorption regardless of the air exposure time periods.
AbstractList A mechanism of H 2 O absorption into SiO x films for forming hydrophobic surfaces is experimentally studied with annealing at several temperatures followed by exposure to several environment conditions. A key requisite to suppress H 2 O absorption was found to be a hydrophobic-like surface of SiO x , which was formed by annealing above 700°C, which completely removes the Si-OH group. This result indicates the possibility to fabricate the completed SiO x films that almost prevent H 2 O absorption regardless of the air exposure time periods.
Author Toyama, Munehiro
Matsumaro, Kazuyuki
Ogawa, Shinichi
Ueda, Tetsuya
Kiso, Osamu
Takezawa, Yasunari
Abe, Shoji
Suzuki, Chikashi
Author_xml – sequence: 1
  givenname: Tetsuya
  surname: Ueda
  fullname: Ueda, Tetsuya
  email: ueda.tetsuya001@aist.go.jp
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 2
  givenname: Osamu
  surname: Kiso
  fullname: Kiso, Osamu
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 3
  givenname: Shoji
  surname: Abe
  fullname: Abe, Shoji
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 4
  givenname: Yasunari
  surname: Takezawa
  fullname: Takezawa, Yasunari
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 5
  givenname: Kazuyuki
  surname: Matsumaro
  fullname: Matsumaro, Kazuyuki
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 6
  givenname: Chikashi
  surname: Suzuki
  fullname: Suzuki, Chikashi
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 7
  givenname: Munehiro
  surname: Toyama
  fullname: Toyama, Munehiro
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
– sequence: 8
  givenname: Shinichi
  surname: Ogawa
  fullname: Ogawa, Shinichi
  organization: National Institute of Advanced Industrial Science and Technology (AIST),Ibakaki,Japan
BookMark eNotkN9KwzAYxaMouE6fQJC8QGe-JE2TSynqBoNebLse_fPFRWdTkhbd29vhrg7n8OPAOQm56XyHhDwBWwAw87xabQuZK5MvOONsYTLIlDJXJIGca1AAQl6TGReapUoIfUeSGD_ZhIIUM7LbjH0fMEbnO-otXfKSVnX0oR_OSX2ih1MbfH_wtWvSo_tCGsdgqwbP9MaVv_THDQc_DpNJyyX9CH7s78mtrY4RHy46J7u3122xTNfl-6p4WacOIJOpVaZFhrpVuUGrdNbotgW03AgrsOYA0DaQWWyUstMSK-tKSKFBNiqbdok5efzvdYi474P7rsJpf7lA_AGNNFLg
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/IITC47697.2020.9515669
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Xplore POP ALL
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISBN 1728161134
9781728161136
EISSN 2380-6338
EndPage 102
ExternalDocumentID 9515669
Genre orig-research
GroupedDBID 6IE
6IF
6IK
6IL
6IN
AAJGR
AAWTH
ADZIZ
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
CHZPO
IPLJI
M43
OCL
RIE
RIL
ID FETCH-LOGICAL-i1154-f69de0e8d679ef685c8dd1ef293f3eb2111dc15fec66f611f4ba343814c651343
IEDL.DBID RIE
IngestDate Wed Aug 27 02:25:02 EDT 2025
IsPeerReviewed false
IsScholarly false
Language English
Japanese
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i1154-f69de0e8d679ef685c8dd1ef293f3eb2111dc15fec66f611f4ba343814c651343
PageCount 3
ParticipantIDs ieee_primary_9515669
PublicationCentury 2000
PublicationDate 2020-Oct.-5
PublicationDateYYYYMMDD 2020-10-05
PublicationDate_xml – month: 10
  year: 2020
  text: 2020-Oct.-5
  day: 05
PublicationDecade 2020
PublicationTitle Proceedings of the IEEE International Interconnect Technology Conference
PublicationTitleAbbrev IITC
PublicationYear 2020
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0020143
Score 1.7389383
Snippet A mechanism of H 2 O absorption into SiO x films for forming hydrophobic surfaces is experimentally studied with annealing at several temperatures followed by...
SourceID ieee
SourceType Publisher
StartPage 100
SubjectTerms Absorption
Annealing
Conferences
Contact angle
H 2 O
Hydrophobic
Permittivity
Si-OH
SiO x
SiO2
TDS
Water
Title Suppression of H2O absorption by hydrophobic-like surface of SiOx without Si-OH group
URI https://ieeexplore.ieee.org/document/9515669
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1La8JAEF7UU3vpQ0vf7KHHJhrNbpKzVGLBWqiCN8nuzmKwJBITqP31nU1S-6CH3jYhL3Zhv_km831DyB2GtJFCymUJKZGgOMhTfImsVUmGiCRcYMKkBiZPPJy7jwu2aJD7vRYGAMriM7DNsPyXr1JZmFRZF6MBjD6CJml6Pq-0WntyZXzqagWw0wu64_Fs6Ho88JAC9nt2feePFiolgoyOyOTz3VXhyNoucmHL91-2jP_9uGPS-dLq0ec9Cp2QBiSn5PCbzWCbzE3rzqreNaGppmF_SiOxTbNyu6BiR1c7laWbVSpiab3Ga6DbItMRPhmvfomnb9Ska9MixwNrGtJSCtIh89HDbBhadTsFKzaeO5bmgYIe-Ip7AWjuM-kr5YBGwNcDJNi46ynpMA2Sc80dR7siGhgHMFdy5uDojLSSNIFzQiEYcAY8YD6GU0L3hVBOyc1cF1xkVBekbSZouakcM5b13Fz-ffqKHJhFKkvk2DVp5VkBNwj1ubgt1_gDvFuoUQ
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3JbsIwELUoPbS9dIGqe33osQECtknOqCi0LJUKEjcU22MRUSUIiFT69R2HlC7qoTcnyiZb8ps3mfeGkDsMaUONlMuRSiFBcZGneApZq1YcEUky4NKmBnp9EYzY45iPC-R-q4UBgKz4DCp2mP3L14lKbaqsitEARh_-DtnljDG-UWtt6ZV1qss1wG7Nr3Y6wxZrCr-JJLBeq-T3_miikmFI-5D0Pt--KR2ZVdKVrKj3X8aM__28I1L-UuvR5y0OHZMCxCfk4JvRYImMbPPOTcVrTBNDg_qAhnKZLLINg8o1na71IplPExkp5zWaAV2mCxPik_Hql2jwRm3CNklXeOAMApqJQcpk1H4YtgInb6jgRNZ1xzHC11ADT4umD0Z4XHlau2AQ8k0DKTbue1q53IASwgjXNUyGDesBxpTgLo5OSTFOYjgjFPyG4CB87mFAJU1dSu1m7IwxYMipzknJTtBkvvHMmORzc_H36VuyFwx73Um303-6JPt2wbKCOX5FiqtFCtcI_Ct5k633B707q54
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=proceeding&rft.title=Proceedings+of+the+IEEE+International+Interconnect+Technology+Conference&rft.atitle=Suppression+of+H2O+absorption+by+hydrophobic-like+surface+of+SiOx+without+Si-OH+group&rft.au=Ueda%2C+Tetsuya&rft.au=Kiso%2C+Osamu&rft.au=Abe%2C+Shoji&rft.au=Takezawa%2C+Yasunari&rft.date=2020-10-05&rft.pub=IEEE&rft.eissn=2380-6338&rft.spage=100&rft.epage=102&rft_id=info:doi/10.1109%2FIITC47697.2020.9515669&rft.externalDocID=9515669