Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography

By using both FEMLAB simulator and the Thermography, the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. And, the deformation pattern was measured by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation patt...

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Bibliographic Details
Published in2005 IEEE Instrumentationand Measurement Technology Conference Proceedings Vol. 3; pp. 1965 - 1969
Main Authors Netsu, T., Taniguchi, M., Ishida, H., Yanada, T., Takagi, T.
Format Conference Proceeding
LanguageEnglish
Japanese
Published IEEE 22.03.2006
Subjects
Analytical models
Circuit analysis
Circuit simulation
Deformable models
Deformation analysis
Graphics
Holography
Image analysis
Pattern analysis
Printed circuit board
Printed circuits
Thermal stress
Thermal stresses
Thermography
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ISBN9780780388796
0780388798
ISSN1091-5281
DOI10.1109/IMTC.2005.1604515

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Summary:By using both FEMLAB simulator and the Thermography, the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. And, the deformation pattern was measured by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3-D graphic image
ISBN:9780780388796
0780388798
ISSN:1091-5281
DOI:10.1109/IMTC.2005.1604515