APA (7th ed.) Citation

Netsu, T., Taniguchi, M., Ishida, H., Yanada, T., & Takagi, T. (2006). Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography. 2005 IEEE Instrumentationand Measurement Technology Conference Proceedings, 3, 1965-1969. https://doi.org/10.1109/IMTC.2005.1604515

Chicago Style (17th ed.) Citation

Netsu, T., M. Taniguchi, H. Ishida, T. Yanada, and T. Takagi. "Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography." 2005 IEEE Instrumentationand Measurement Technology Conference Proceedings 3 (2006): 1965-1969. https://doi.org/10.1109/IMTC.2005.1604515.

MLA (9th ed.) Citation

Netsu, T., et al. "Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography." 2005 IEEE Instrumentationand Measurement Technology Conference Proceedings, vol. 3, 2006, pp. 1965-1969, https://doi.org/10.1109/IMTC.2005.1604515.