Direct deposition of Cu/barrier stacks on dielectric/nonconductive layers using supercritical CO/sub 2 - Kondoh, E.; Hishikawa, M.; Yanagihara, M.; Shigama, K. (Proceedings of the IEEE 2004 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004, 2004)
Keywords: Additives; Chemistry; Conductivity; Copper; Dielectrics; Inductors; Metallization; Pressure control; Reservoirs; Surface tension