MEMS Packaging Technologies and 3D Integration

• Format: eBook
• Language: English
• Published: MDPI - Multidisciplinary Digital Publishing Institute 2022
• Subjects: adhesion; Au film thickness; Au-Au bonding; biocompatible packaging; Biology, life sciences; capacitive micromachined ultrasound transducers (CMUT); chronic implantation; crack propagation; deflection angle; equivalent circuit model; fan-out wafer-level package; fan-out wafer-level packaging (FOWLP); FEM; finite difference time domain; finite element; finite element analysis; Finite element method (FEM); fuzzy AHP; fuzzy VIKOR; glass substrate; heterogeneous integration; implantable; inkjet printing; integrated nanostructure-multilayer reactive system; low-temperature MEMS packaging; Mathematics and Science; MCDM; MEMS and IC integration; MEMS resonator; metal direct bonding; microbump; microelectromechanical systems (MEMS) packaging; microsystem integration; millimeter-wave; multilayer reactive bonding; n/a; neural interface; neural probe; Ni/Al reactive multilayer system; optical and electromagnetics simulations; packaging-on-packaging; parylene; Pd/Al reactive multilayer system; polymer packaging; redistribution layers; redundant TSV; Reference, Information and Interdisciplinary subjects; reliability; reliability life; Research and information: general; room-temperature bonding; S-parameters extraction; scotch tape test; self-propagating exothermic reaction; simulation; spontaneous self-ignition; stress intensity factor (SIF); surface activated bonding; surface roughness; technology evaluation; temperature coefficient; thermal sensors; thermal stress; thin film metal; TMOS sensor; ultrasonic bonding; wafer bonding; wafer sealing
• ISBN: 3036542574; 9783036542577; 3036542582; 9783036542584
• DOI: 10.3390/books978-3-0365-4257-7

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.