基于光学读出非制冷红外成像系统的无基底FPA等效电学模型

TN216; 与传统的有基底FPA(焦平面阵列)相比,基于全镂空支撑框架结构的新型无基底FPA在热学特性上存在显著差异,传统的基于恒温基底假设的热学分析模型不再适用,因此,通过电学比拟方法,将无基底FPA的热响应特性等效为电学模型.通过该模型,进一步分析了无基底FPA在非真空环境下的热学性能,分析表明:该无基底FPA具有在大气压下优良的红外成像性能,其NETD(噪声等效温度差)值仅比真空环境下增加了数倍....

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Bibliographic Details
Published in红外与毫米波学报 Vol. 32; no. 5; pp. 394 - 399
Main Author 张勇 程腾 张青川 陈大鹏 高杰 毛亮 吴健雄 高越
Format Journal Article
LanguageChinese
Published 中国科学技术大学中国科学院材料力学行为和设计重点实验室,安徽合肥,230027%中国科学院微电子研究所,北京,100029 2013
Subjects
光学读出
焦平面阵列
电学比拟
等效电学模型
非制冷红外成像
电学比拟
非制冷红外成像
等效电学模型
uncooled infrared imaging
焦平面阵列
optical readout
光学读出
focal plane array
electrics and holistic approach
equivalent circuit model
Online AccessGet full text
ISSN1001-9014
DOI10.3724/SP.J.1010.2013.00394

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Summary:TN216; 与传统的有基底FPA(焦平面阵列)相比,基于全镂空支撑框架结构的新型无基底FPA在热学特性上存在显著差异,传统的基于恒温基底假设的热学分析模型不再适用,因此,通过电学比拟方法,将无基底FPA的热响应特性等效为电学模型.通过该模型,进一步分析了无基底FPA在非真空环境下的热学性能,分析表明:该无基底FPA具有在大气压下优良的红外成像性能,其NETD(噪声等效温度差)值仅比真空环境下增加了数倍.
Bibliography:Thermal characteristics of new substrate-free FPA （focal plane array） with full hollow supporting frame struc- ture are very different from that of traditional substrate FPA. The thermal analysis model which based on temperature- constant substrate assumption is not efficient any more. Therefore, an equivalent circuit model was presented to analyze the thermal response characteristics of substrate-free FPA with electrics and holistic approach. According to this model, the thermal characteristics of substrate-free FPA under non-vacuum environment were analyzed. The result shows that, the substrate-free FPA has excellent infrared imaging performances under atmospheric pressure, while its NETD （noise equivalent temperature difference） is just increased several times than in the vacuum environment.
31-1577/TN
ZHANG Yong, CHENG Teng ZHANG Qing-Chuan CHEN Da-Peng GAO Jie, MAO Liang , WU Jian-Xiong , GAO Yue （ 1. CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of
ISSN:1001-9014
DOI:10.3724/SP.J.1010.2013.00394