Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接
采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜（OM）、扫描电镜（SEM）、能谱（EDS）及X射线衍射（XRD）分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成。结果表明：在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体＋Ti＋NbTi4,Nb和剩余Cu＋[Cu,Fe]固溶体＋Cr。接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上。Nb对接头残余应力的改善起到关键作用,界面强度...
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| Published in | 材料工程 no. 12; pp. 60 - 65 |
|---|---|
| Main Author | |
| Format | Journal Article |
| Language | Chinese |
| Published |
重庆大学材料科学与工程学院,重庆,400044
2014
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| Subjects | |
| Online Access | Get full text |
| ISSN | 1001-4381 1001-4381 |
| DOI | 10.11868/j.issn.1001-4381.2014.12.011 |
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| Abstract | 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜（OM）、扫描电镜（SEM）、能谱（EDS）及X射线衍射（XRD）分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成。结果表明：在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体＋Ti＋NbTi4,Nb和剩余Cu＋[Cu,Fe]固溶体＋Cr。接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上。Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度。 |
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| AbstractList | 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜（OM）、扫描电镜（SEM）、能谱（EDS）及X射线衍射（XRD）分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成。结果表明：在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体＋Ti＋NbTi4,Nb和剩余Cu＋[Cu,Fe]固溶体＋Cr。接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上。Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度。 TG457; 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接.通过光学金相显微镜(OM)、扫描电镜(SEM)、能谱(EDS)及X射线衍射(XRD)分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成.结果表明:在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体+Ti+ NbTi4,Nb和剩余Cu+[Cu,Fe]固溶体+Cr.接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上.Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度. |
| Author | 李佳 盛光敏 |
| AuthorAffiliation | 重庆大学材料科学与工程学院,重庆400044 |
| AuthorAffiliation_xml | – name: 重庆大学材料科学与工程学院,重庆,400044 |
| Author_FL | SHENG Guang-min LI Jia |
| Author_FL_xml | – sequence: 1 fullname: LI Jia – sequence: 2 fullname: SHENG Guang-min |
| Author_xml | – sequence: 1 fullname: 李佳 盛光敏 |
| BookMark | eNpNj0tLw0AUhQepYK39E0KXSebOq5mVSPAFRTfZh2SS1JQ61YYibkW0LhS0ulCkC8WFy7pQF4p_pg_zL4xUxM259xw-7uXMo4Ju6QihCmATwBa21TCTNNUmYAwGozaYBAMzgZgYYAYV__LCv30OldM0CXILmAOwIlpyE2szsJzO8ONu8t4bHT-PBoeT2yM3cbKTi9Ggn928THqvFsVs-HaWXXWzy_vx6dP4-uHrsz8-f1xAs7HfTKPy7ywhd3XFddaN2tbahrNcMxSvgkGl8mMqfGkzLiSEIgqFHSmuSBjEMZc4xEpKGzjjNM8kDqoqqEaSYaJwGGFaQpXp2X1fx76ue41Wp63zh55q1tVPc8gFcm5xyqntlq7vJTm52052_PaBJwTlhBLC6TfbmWsq |
| ClassificationCodes | TG457 |
| ContentType | Journal Article |
| Copyright | Copyright © Wanfang Data Co. Ltd. All Rights Reserved. |
| Copyright_xml | – notice: Copyright © Wanfang Data Co. Ltd. All Rights Reserved. |
| DBID | 2RA 92L CQIGP W92 ~WA 2B. 4A8 92I 93N PSX TCJ |
| DOI | 10.11868/j.issn.1001-4381.2014.12.011 |
| DatabaseName | 维普期刊资源整合服务平台 中文科技期刊数据库-CALIS站点 维普中文期刊数据库 中文科技期刊数据库-工程技术 中文科技期刊数据库- 镜像站点 Wanfang Data Journals - Hong Kong WANFANG Data Centre Wanfang Data Journals 万方数据期刊 - 香港版 China Online Journals (COJ) China Online Journals (COJ) |
| DatabaseTitleList | |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| DocumentTitleAlternate | Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers |
| DocumentTitle_FL | Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers |
| EISSN | 1001-4381 |
| EndPage | 65 |
| ExternalDocumentID | clgc201412011 663523225 |
| GrantInformation_xml | – fundername: 国家自然科学基金资助项目 funderid: (50675234) |
| GroupedDBID | -02 2.D 2B. 2C0 2RA 2VQ 5VS 5XA 5XC 92H 92I 92L ACBEA ACGFS ACIWK ALMA_UNASSIGNED_HOLDINGS AMTXH CCEZO CDRFL CQIGP CW9 FEDTE FIJ GROUPED_DOAJ HVGLF IPNFZ RIG TCJ TGT U1G U5L W92 ~WA 4A8 93N ABJNI PSX |
| ID | FETCH-LOGICAL-c571-39caf36a9845691d6ed68ec5c2dbff590d0c99815453c2d90b7cb7e9402c0de03 |
| ISSN | 1001-4381 |
| IngestDate | Thu May 29 04:06:47 EDT 2025 Wed Feb 14 10:35:55 EST 2024 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 12 |
| Keywords | diffusion bonding TiC金属陶瓷 microstructure Ti/Nb/Cu复合中间层 断裂 扩散连接 TiC cermet 组织 Ti/Nb/Cu multi-interlayer fracture |
| Language | Chinese |
| LinkModel | OpenURL |
| MergedId | FETCHMERGED-LOGICAL-c571-39caf36a9845691d6ed68ec5c2dbff590d0c99815453c2d90b7cb7e9402c0de03 |
| Notes | 11-1800/TB LI Jia,SHENG Guang-min （College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China） diffusion bonding ;TiC cermet ; Ti/Nb/Cu multi-interlayer ; microstructure ; fracture The vacuum diffusion bonding of TiC cermet and 304 stainless steel （304SS） was conducted with Ti/Nb/Cu multi-interlayer at 925℃ for 20min with a pressure of 8MPa. The microstructures, fracture morphology elemental distribution of reaction interface and phase composition of fracture sur- face were investigated with optical microscopy（OM）, scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and X-ray diffraction （XRD）. The results show that an obvious transi- tion zone is formed between TiC cermet and 304SS, and the interface products are [Ti,Nb] solid solu- tion＋Ti＋NbTi4 ,Nb, remnant Cu＋[Cu,Fe] solid solution＋Cr. The shear strength of joints is up to 84.6MPa. The failure mostly occurs in diffusion reaction layer between TiC and Ti within TiC cer met. Nb interlayer plays a major role |
| PageCount | 6 |
| ParticipantIDs | wanfang_journals_clgc201412011 chongqing_primary_663523225 |
| PublicationCentury | 2000 |
| PublicationDate | 2014 |
| PublicationDateYYYYMMDD | 2014-01-01 |
| PublicationDate_xml | – year: 2014 text: 2014 |
| PublicationDecade | 2010 |
| PublicationTitle | 材料工程 |
| PublicationTitleAlternate | Journal of Materials Engineering |
| PublicationTitle_FL | Journal of Materials Engineering |
| PublicationYear | 2014 |
| Publisher | 重庆大学材料科学与工程学院,重庆,400044 |
| Publisher_xml | – name: 重庆大学材料科学与工程学院,重庆,400044 |
| SSID | ssib001105114 ssib038074674 ssib051373031 ssib044725097 ssj0002507531 ssib023166898 |
| Score | 1.990755 |
| Snippet | 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜（OM）、扫描电镜（SEM）、能... TG457; 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接.通过光学金相显微镜(OM)、扫描电镜(SEM)、... |
| SourceID | wanfang chongqing |
| SourceType | Aggregation Database Publisher |
| StartPage | 60 |
| SubjectTerms | Ti/Nb/Cu复合中间层 TiC金属陶瓷 扩散连接 断裂 组织 |
| Title | Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接 |
| URI | http://lib.cqvip.com/qk/92115X/201412/663523225.html https://d.wanfangdata.com.cn/periodical/clgc201412011 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| journalDatabaseRights | – providerCode: PRVAON databaseName: DOAJ Directory of Open Access Journals customDbUrl: eissn: 1001-4381 dateEnd: 99991231 omitProxy: true ssIdentifier: ssj0002507531 issn: 1001-4381 databaseCode: DOA dateStart: 20120101 isFulltext: true titleUrlDefault: https://www.doaj.org/ providerName: Directory of Open Access Journals – providerCode: PRVALS databaseName: IngentaConnect Open Access Journals customDbUrl: eissn: 1001-4381 dateEnd: 20150615 omitProxy: true ssIdentifier: ssj0002507531 issn: 1001-4381 databaseCode: FIJ dateStart: 20110115 isFulltext: true titleUrlDefault: http://www.ingentaconnect.com/content/title?j_type=online&j_startat=Aa&j_endat=Af&j_pagesize=200&j_page=1 providerName: Ingenta |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3Nb9MwFLfKkBAcEJ9iDKod8AllTew4sU8o6VKNSfRUpN2qxEm3SVPHR3vZESG-JJBgcAChHUAcOI4DcADxz6wt_S94z8naIKYJkKrItV_ec_Ic-_ee7WdCrnANRkPMtOVnDAwUltiWlDG3Yu642peiI1zcjXyj6S3ddJdXxEql8qS0aqnfSxb01oH7Sv5Hq5AHesVdsv-g2QlTyIA06BeuoGG4_p2O8d5mgjFu-zRyabhIVZ1GPg3rVHEaCSo9GjJMhA6VDItUQKXbWgcyRSX8dYpSFWGOUjT0DBmnIU6zcts1nCWVi4YAsKc0CUYDYOhRqWigMKEEDUCopGHDcIOiiAaiDH8NGVTSNgkPxaF0H8hQaABSJlNABS3wyJ8s5FdNxUL84aMJFJ3LlY2y9yLfL1p0tbiYCwOM5SPRAXlFy2Ol_jU_e6AYqfNDJv4cA6QnzSCALBcmLHEZn2tcv0Xv_nuYbUReDHu3I-QoQ98Ohgy9vjyFlgBEnemMM8Biz5NTUxXj9ruluEiu6wO4nM7QCodDX1rMuCJKgFKwFI0_YL-Gxwjdr3_tsNpjGJC1ze7qbQA3Zq9ZtxN3V0uwqHWKnCzsmfkgb5ynSWVr7Qw5UYpyeZZca63Xmkmt3t_7_nb0bXvw4NNg997ozX1ohOOHzwe7O-PXn0fbX2rQ1Pa-Ph2_fDR-8W74-OPw1fufP3aGzz6cI61G1KovWcW5HZYWvmNxpeMO92IlAZwrJ_Wy1JOZFpqlSacjlJ3aGox8xO4c8pSd-DrxM-XaTNtpZvPzZKa72c0ukHmbJTDkuBmYLQqgpJAJ6wghs9R3EqlZNkvmJm-ifSsPz9KeaHKWVIt30y4-2rttvbGq8VU6CHwvHnr7HDmOlLm_7RKZ6d3pZ5cBgfaSqvHcVE0D-QUmm2WL |
| linkProvider | Ingenta |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Ti%2FNb%2FCu%E4%BD%9C%E7%BC%93%E5%86%B2%E5%B1%82%E7%9A%84TiC%E9%87%91%E5%B1%9E%E9%99%B6%E7%93%B7%2F304%E4%B8%8D%E9%94%88%E9%92%A2%E6%89%A9%E6%95%A3%E8%BF%9E%E6%8E%A5&rft.jtitle=%E6%9D%90%E6%96%99%E5%B7%A5%E7%A8%8B&rft.au=%E6%9D%8E%E4%BD%B3+%E7%9B%9B%E5%85%89%E6%95%8F&rft.date=2014&rft.issn=1001-4381&rft.eissn=1001-4381&rft.issue=12&rft.spage=60&rft.epage=65&rft_id=info:doi/10.11868%2Fj.issn.1001-4381.2014.12.011&rft.externalDocID=663523225 |
| thumbnail_s | http://utb.summon.serialssolutions.com/2.0.0/image/custom?url=http%3A%2F%2Fimage.cqvip.com%2Fvip1000%2Fqk%2F92115X%2F92115X.jpg http://utb.summon.serialssolutions.com/2.0.0/image/custom?url=http%3A%2F%2Fwww.wanfangdata.com.cn%2Fimages%2FPeriodicalImages%2Fclgc%2Fclgc.jpg |