APA (7th ed.) Citation

Kobayashi, Y., Abe, Y., Maeda, T., Yasuda, Y., & Morita, T. (2014). A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles. Journal of materials research and technology, 3(2), 114-121. https://doi.org/10.1016/j.jmrt.2013.12.003

Chicago Style (17th ed.) Citation

Kobayashi, Yoshio, Yuki Abe, Takafumi Maeda, Yusuke Yasuda, and Toshiaki Morita. "A Metal–metal Bonding Process Using Metallic Copper Nanoparticles Produced by Reduction of Copper Oxide Nanoparticles." Journal of Materials Research and Technology 3, no. 2 (2014): 114-121. https://doi.org/10.1016/j.jmrt.2013.12.003.

MLA (9th ed.) Citation

Kobayashi, Yoshio, et al. "A Metal–metal Bonding Process Using Metallic Copper Nanoparticles Produced by Reduction of Copper Oxide Nanoparticles." Journal of Materials Research and Technology, vol. 3, no. 2, 2014, pp. 114-121, https://doi.org/10.1016/j.jmrt.2013.12.003.