APA (7th ed.) Citation

Kagawa, R., Cheng, Z., Kawamura, K., Ohno, Y., Moriyama, C., Sakaida, Y., . . . Liang, J. (2024). High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes. Small, 20(13), e2305574-n/a. https://doi.org/10.1002/smll.202305574

Chicago Style (17th ed.) Citation

Kagawa, Ryo, et al. "High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes." Small 20, no. 13 (2024): e2305574-n/a. https://doi.org/10.1002/smll.202305574.

MLA (9th ed.) Citation

Kagawa, Ryo, et al. "High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes." Small, vol. 20, no. 13, 2024, pp. e2305574-n/a, https://doi.org/10.1002/smll.202305574.