Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films?
The limited ductility of metallic thin films (< 1%) poses a challenge to MEMS and flexible electronics applications. Here, we report on freestanding gold specimens with the remarkable ability to accommodate ≥10% plastic deformation while retaining a high strength. Using in situ nanomechanical tes...
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| Published in | Acta materialia Vol. 215; p. 117079 |
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| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
15.08.2021
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| Subjects | |
| Online Access | Get full text |
| ISSN | 1359-6454 1873-2453 |
| DOI | 10.1016/j.actamat.2021.117079 |
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| Abstract | The limited ductility of metallic thin films (< 1%) poses a challenge to MEMS and flexible electronics applications. Here, we report on freestanding gold specimens with the remarkable ability to accommodate ≥10% plastic deformation while retaining a high strength. Using in situ nanomechanical testing in a transmission electron microscope, this exceptionally high ductility is traced back to the combination of an ultrathin thickness, a columnar microstructure and a (111) fiber texture. Under such conditions, the deformation is largely mediated by grain boundaries through grain boundary sliding and shear coupled grain boundary migration. Because these non-conventional mechanisms preserve the cross-sectional thickness of the specimens, necking is postponed and the samples can reach a high ductility. Since the mechanisms were evidenced at room temperature and under strain-rate conditions typical of most applications, the findings open up promising outlooks for developing ductile metallic films by microstructural engineering. |
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| AbstractList | The limited ductility of metallic thin films (< 1%) poses a challenge to MEMS and flexible electronics applications. Here, we report on freestanding gold specimens with the remarkable ability to accommodate ≥10% plastic deformation while retaining a high strength. Using in situ nanomechanical testing in a transmission electron microscope, this exceptionally high ductility is traced back to the combination of an ultrathin thickness, a columnar microstructure and a (111) fiber texture. Under such conditions, the deformation is largely mediated by grain boundaries through grain boundary sliding and shear coupled grain boundary migration. Because these non-conventional mechanisms preserve the cross-sectional thickness of the specimens, necking is postponed and the samples can reach a high ductility. Since the mechanisms were evidenced at room temperature and under strain-rate conditions typical of most applications, the findings open up promising outlooks for developing ductile metallic films by microstructural engineering. |
| ArticleNumber | 117079 |
| Author | Liebig, Jan P. Spiecker, Erdmann Göken, Mathias Merle, Benoit Mačković, Mirza |
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| Keywords | Thin films Transmission electron microscopy Nanomechanical testing Ductility Deformation mechanisms |
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| SubjectTerms | Deformation mechanisms Ductility Nanomechanical testing Thin films Transmission electron microscopy |
| Title | Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films? |
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