Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm - Zhuo-Yue Li; Mu-Shui Zhang (IEEE transactions on components, packaging, and manufacturing technology (2011), 2015)
Keywords: Ball grid array (BGA) package; Biological cells; Genetic algorithms; Inductance; Linear programming; Optimization; pin assignment; Pins; signal integrity (SI); Silicon; system in package (SiP); Ball grid array (BGA) package; pin assignment; system in package (SiP); signal integrity (SI)