APA (7th ed.) Citation

Syafei, D. I., Chiang, M., & Chuang, T. (2023). Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias. Metals (Basel ), 13(10), 1747. https://doi.org/10.3390/met13101747

Chicago Style (17th ed.) Citation

Syafei, Devi Indrawati, Meng-Ting Chiang, and Tung-Han Chuang. "Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer Under Various Substrate Bias." Metals (Basel ) 13, no. 10 (2023): 1747. https://doi.org/10.3390/met13101747.

MLA (9th ed.) Citation

Syafei, Devi Indrawati, et al. "Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer Under Various Substrate Bias." Metals (Basel ), vol. 13, no. 10, 2023, p. 1747, https://doi.org/10.3390/met13101747.