Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology - 韩宗杰 薛松柏 王俭辛 张昕 张亮 禹胜林 王慧 (Transactions of Nonferrous Metals Society of China, 2008)
Keywords: diode laser soldering; lead-free solders; mechanical properties; quad flat package micro-joints; 二极管激光软钎焊; 微观结构; 无铅焊料; 机械性能; lead-free solders; diode laser soldering; mechanical properties; quad flat package micro-joints