王慧, 韩. 薛. 王. 张. 张. 禹. (2008). Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology. Transactions of Nonferrous Metals Society of China, 18(4), 814-818. https://doi.org/10.1016/S1003-6326(08)60141-7
Chicago Style (17th ed.) Citation王慧, 韩宗杰 薛松柏 王俭辛 张昕 张亮 禹胜林. "Mechanical Properties of QFP Micro-joints Soldered with Lead-free Solders Using Diode Laser Soldering Technology." Transactions of Nonferrous Metals Society of China 18, no. 4 (2008): 814-818. https://doi.org/10.1016/S1003-6326(08)60141-7.
MLA (9th ed.) Citation王慧, 韩宗杰 薛松柏 王俭辛 张昕 张亮 禹胜林. "Mechanical Properties of QFP Micro-joints Soldered with Lead-free Solders Using Diode Laser Soldering Technology." Transactions of Nonferrous Metals Society of China, vol. 18, no. 4, 2008, pp. 814-818, https://doi.org/10.1016/S1003-6326(08)60141-7.