Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method - Yang, Wen-Jei; Furukawa, Takahiro; Torii, Shuichi (International journal of heat and mass transfer, 2008)
Keywords: Applied sciences; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Pipe flow; Electronic packaging; Cooling system; Printed circuit board; Numerical simulation; Entropy; Spacing; Convection cooling; Modeling; Optimization; Heat transfer; Optimal design