1T1C FeRAM Memory Array Based on Ferroelectric HZO With Capacitor Under Bitline

A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf 0.5 Zr 0.5 O 2 with a capacitor under bitline (CUB) structure was experimentally demonstrated. The CUB structure facilitates the application of post-metall...

Full description

Saved in:
Bibliographic Details
Published inIEEE journal of the Electron Devices Society Vol. 10; pp. 29 - 34
Main Authors Okuno, Jun, Kunihiro, Takafumi, Konishi, Kenta, Materano, Monica, Ali, Tarek, Kuehnel, Kati, Seidel, Konrad, Mikolajick, Thomas, Schroeder, Uwe, Tsukamoto, Masanori, Umebayashi, Taku
Format Journal Article
LanguageEnglish
Published New York IEEE 2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text
ISSN2168-6734
2168-6734
DOI10.1109/JEDS.2021.3129279

Cover

Abstract A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf 0.5 Zr 0.5 O 2 with a capacitor under bitline (CUB) structure was experimentally demonstrated. The CUB structure facilitates the application of post-metallization annealing on metal/ferroelectric/metal capacitors above 500 °C because they are fabricated before the back-end-of-line process. A large remanent polarization of 2Pr <inline-formula> <tex-math notation="LaTeX"> {>}40~\mu \text{C} </tex-math></inline-formula>/cm 2 , projected endurance <inline-formula> <tex-math notation="LaTeX">{>}10^{11} </tex-math></inline-formula> cycles, and ten years of data retention at 85 °C were obtained at 500 °C, after metallization using a single large capacitor. Furthermore, a large memory window of the 64 kbit 1T1C FeRAM array with 500 °C post-metallization was comprehensively demonstrated without degradation of the underlying CMOS logic transistors. The operation voltage and speed dependence were extensively investigated using a dedicated sense amplifier for the 1T1C FeRAM. Furthermore, the perfect bit functionality at an operation voltage of 2.5 V and a read/write speed < 10 ns were obtained. Therefore, superior properties of CUB-structured 1T1C FeRAM can be achieved by flexible process engineering of crystallization annealing for metal/ferroelectric/metal fabrication.
AbstractList A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf0.5Zr0.5O2 with a capacitor under bitline (CUB) structure was experimentally demonstrated. The CUB structure facilitates the application of post-metallization annealing on metal/ferroelectric/metal capacitors above 500 °C because they are fabricated before the back-end-of-line process. A large remanent polarization of 2Pr [Formula Omitted]/cm2, projected endurance [Formula Omitted] cycles, and ten years of data retention at 85 °C were obtained at 500 °C, after metallization using a single large capacitor. Furthermore, a large memory window of the 64 kbit 1T1C FeRAM array with 500 °C post-metallization was comprehensively demonstrated without degradation of the underlying CMOS logic transistors. The operation voltage and speed dependence were extensively investigated using a dedicated sense amplifier for the 1T1C FeRAM. Furthermore, the perfect bit functionality at an operation voltage of 2.5 V and a read/write speed
A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf 0.5 Zr 0.5 O 2 with a capacitor under bitline (CUB) structure was experimentally demonstrated. The CUB structure facilitates the application of post-metallization annealing on metal/ferroelectric/metal capacitors above 500 °C because they are fabricated before the back-end-of-line process. A large remanent polarization of 2Pr <inline-formula> <tex-math notation="LaTeX"> {>}40~\mu \text{C} </tex-math></inline-formula>/cm 2 , projected endurance <inline-formula> <tex-math notation="LaTeX">{>}10^{11} </tex-math></inline-formula> cycles, and ten years of data retention at 85 °C were obtained at 500 °C, after metallization using a single large capacitor. Furthermore, a large memory window of the 64 kbit 1T1C FeRAM array with 500 °C post-metallization was comprehensively demonstrated without degradation of the underlying CMOS logic transistors. The operation voltage and speed dependence were extensively investigated using a dedicated sense amplifier for the 1T1C FeRAM. Furthermore, the perfect bit functionality at an operation voltage of 2.5 V and a read/write speed < 10 ns were obtained. Therefore, superior properties of CUB-structured 1T1C FeRAM can be achieved by flexible process engineering of crystallization annealing for metal/ferroelectric/metal fabrication.
A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf0.5Zr0.5O2 with a capacitor under bitline (CUB) structure was experimentally demonstrated. The CUB structure facilitates the application of post-metallization annealing on metal/ferroelectric/metal capacitors above 500 °C because they are fabricated before the back-end-of-line process. A large remanent polarization of 2Pr <tex-math notation="LaTeX">$ {>}40~\mu \text{C}$ </tex-math>/cm2, projected endurance <tex-math notation="LaTeX">${>}10^{11}$ </tex-math> cycles, and ten years of data retention at 85 °C were obtained at 500 °C, after metallization using a single large capacitor. Furthermore, a large memory window of the 64 kbit 1T1C FeRAM array with 500 °C post-metallization was comprehensively demonstrated without degradation of the underlying CMOS logic transistors. The operation voltage and speed dependence were extensively investigated using a dedicated sense amplifier for the 1T1C FeRAM. Furthermore, the perfect bit functionality at an operation voltage of 2.5 V and a read/write speed < 10 ns were obtained. Therefore, superior properties of CUB-structured 1T1C FeRAM can be achieved by flexible process engineering of crystallization annealing for metal/ferroelectric/metal fabrication.
Author Ali, Tarek
Schroeder, Uwe
Okuno, Jun
Materano, Monica
Tsukamoto, Masanori
Kunihiro, Takafumi
Konishi, Kenta
Kuehnel, Kati
Seidel, Konrad
Umebayashi, Taku
Mikolajick, Thomas
Author_xml – sequence: 1
  givenname: Jun
  orcidid: 0000-0002-8888-0086
  surname: Okuno
  fullname: Okuno, Jun
  email: jun.okuno@sony.com
  organization: Sony Semiconductor Solutions Corporation, Atsugi, Japan
– sequence: 2
  givenname: Takafumi
  surname: Kunihiro
  fullname: Kunihiro, Takafumi
  organization: Sony Semiconductor Solutions Corporation, Atsugi, Japan
– sequence: 3
  givenname: Kenta
  surname: Konishi
  fullname: Konishi, Kenta
  organization: Sony Semiconductor Solutions Corporation, Atsugi, Japan
– sequence: 4
  givenname: Monica
  orcidid: 0000-0003-2039-2120
  surname: Materano
  fullname: Materano, Monica
  organization: NaMLab gGmbH, Dresden, Germany
– sequence: 5
  givenname: Tarek
  orcidid: 0000-0002-9840-3531
  surname: Ali
  fullname: Ali, Tarek
  organization: Center Nanoelectronics Technologies, Fraunhofer IPMS, Dresden, Germany
– sequence: 6
  givenname: Kati
  surname: Kuehnel
  fullname: Kuehnel, Kati
  organization: Center Nanoelectronics Technologies, Fraunhofer IPMS, Dresden, Germany
– sequence: 7
  givenname: Konrad
  surname: Seidel
  fullname: Seidel, Konrad
  organization: Center Nanoelectronics Technologies, Fraunhofer IPMS, Dresden, Germany
– sequence: 8
  givenname: Thomas
  orcidid: 0000-0003-3814-0378
  surname: Mikolajick
  fullname: Mikolajick, Thomas
  organization: NaMLab gGmbH, Dresden, Germany
– sequence: 9
  givenname: Uwe
  orcidid: 0000-0002-6824-2386
  surname: Schroeder
  fullname: Schroeder, Uwe
  organization: NaMLab gGmbH, Dresden, Germany
– sequence: 10
  givenname: Masanori
  surname: Tsukamoto
  fullname: Tsukamoto, Masanori
  organization: Sony Semiconductor Solutions Corporation, Atsugi, Japan
– sequence: 11
  givenname: Taku
  surname: Umebayashi
  fullname: Umebayashi, Taku
  organization: Sony Semiconductor Solutions Corporation, Atsugi, Japan
BookMark eNp9kU9PGzEQxa2KSqXAB6h6sdRzUv9br30MKRQQKFIBIfVizdqzraNlnXrNId--ToNQxQFfxhrP772R30dyMKYRCfnE2ZxzZr9enX27nQsm-FxyYUVr35FDwbWZ6Vaqg__uH8jJNK1ZPYZrq_UhWfE7vqTn-GNxQ2_wMeUtXeQMW3oKEwaaxvqWc8IBfcnR04ufK_oQy2-6hA34WFKm92PATE9jGeKIx-R9D8OEJ8_1iNyfn90tL2bXq--Xy8X1zCsmyqxBaZjs-g4boRuvbY_gG8EDcM8CdLKXqmlk4AiBNdYErbRqAjKtLBpg8ohc7nVDgrXb5PgIeesSRPevkfIvB7lEP6BT0vCuYrIHq3zvjejaLgQGthZju6r1Za-1yenPE07FrdNTHuv6TmhhuVDatHWK76d8TtOUsX9x5cztYnC7GNwuBvccQ2XaV0z9MigxjSVDHN4kP-_JiIgvTlYLLoSWfwFPSpSF
CODEN IJEDAC
CitedBy_id crossref_primary_10_1541_ieejeiss_145_381
crossref_primary_10_1088_1674_4926_44_5_053101
crossref_primary_10_1002_aelm_202200265
crossref_primary_10_1016_j_chip_2024_100101
crossref_primary_10_1109_JSSC_2023_3320659
crossref_primary_10_3390_electronics14040818
crossref_primary_10_1088_1674_4926_45_4_042301
crossref_primary_10_1021_acsami_4c08641
crossref_primary_10_1002_adma_202206864
crossref_primary_10_1109_JEDS_2022_3187101
crossref_primary_10_1039_D4NR01124D
crossref_primary_10_1016_j_jallcom_2023_171247
crossref_primary_10_1016_j_apmt_2024_102346
crossref_primary_10_1021_acsami_4c14022
crossref_primary_10_1103_PhysRevApplied_22_064083
crossref_primary_10_1016_j_cossms_2024_101178
crossref_primary_10_1103_PhysRevApplied_18_064084
crossref_primary_10_3390_nano13152187
crossref_primary_10_1109_TED_2023_3269400
crossref_primary_10_1021_acsami_4c18056
crossref_primary_10_3390_electronics12102297
crossref_primary_10_1063_5_0196828
crossref_primary_10_1109_TED_2022_3216973
crossref_primary_10_1002_adfm_202414187
crossref_primary_10_1088_1361_6463_ad7036
crossref_primary_10_1016_j_sse_2023_108834
crossref_primary_10_1088_1361_6641_ad1130
crossref_primary_10_1109_JXCDC_2024_3488578
crossref_primary_10_7498_aps_72_20222221
crossref_primary_10_1002_apxr_202200108
crossref_primary_10_1002_adfm_202303956
crossref_primary_10_1021_acsami_2c15369
crossref_primary_10_1002_inf2_12380
crossref_primary_10_1109_LED_2023_3330994
Cites_doi 10.1109/IEDM.2017.8268425
10.1021/acsami.6b13866
10.1109/VLSITechnology18217.2020.9265075
10.1109/VLSITechnology18217.2020.9265063
10.1109/IMW.2014.6849367
10.1063/1.3634052
10.1109/IEDM19573.2019.8993485
10.1021/acsami.9b11146
10.1116/1.5134135
10.1109/5.849164
10.1063/1.4927805
10.7567/jjap.53.08le02
10.1109/IEDM.1998.746373
10.1063/5.0035100
10.1109/IEDM19573.2019.8993464
10.1021/nl302049k
10.1109/TDMR.2004.837210
10.1016/j.actamat.2020.116515
10.1109/VTSA.2008.4530807
10.1109/ICICDT.2018.8399771
10.1109/TDMR.2012.2216269
10.1103/physrevb.66.214109
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
DBID 97E
ESBDL
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
DOA
DOI 10.1109/JEDS.2021.3129279
DatabaseName IEEE Xplore (IEEE)
IEEE Xplore Open Access Journals
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DOAJ Directory of Open Access Journals
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList Technology Research Database


Database_xml – sequence: 1
  dbid: DOA
  name: DOAJ Directory of Open Access Journals
  url: https://www.doaj.org/
  sourceTypes: Open Website
– sequence: 2
  dbid: RIE
  name: IEEE Xplore Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2168-6734
EndPage 34
ExternalDocumentID oai_doaj_org_article_4381b49e3fa94cfc82b7bdd0a97bd89b
10_1109_JEDS_2021_3129279
9621226
Genre orig-research
GroupedDBID 0R~
5VS
6IK
97E
AAJGR
ABAZT
ABVLG
ACGFS
ADBBV
AGSQL
ALMA_UNASSIGNED_HOLDINGS
BCNDV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
EJD
ESBDL
GROUPED_DOAJ
IPLJI
JAVBF
KQ8
M43
M~E
O9-
OCL
OK1
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
ID FETCH-LOGICAL-c402t-5e3803bfbe5265c69feac521da1c0dab3f34553d1ead0598d64645de0649e8a03
IEDL.DBID DOA
ISSN 2168-6734
IngestDate Wed Aug 27 01:29:57 EDT 2025
Sun Jun 29 15:52:45 EDT 2025
Tue Jul 01 01:06:51 EDT 2025
Thu Apr 24 23:07:27 EDT 2025
Wed Aug 27 02:49:52 EDT 2025
IsDoiOpenAccess true
IsOpenAccess true
IsPeerReviewed true
IsScholarly true
Language English
License https://creativecommons.org/licenses/by-nc-nd/4.0
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c402t-5e3803bfbe5265c69feac521da1c0dab3f34553d1ead0598d64645de0649e8a03
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-6824-2386
0000-0003-3814-0378
0000-0003-2039-2120
0000-0002-9840-3531
0000-0002-8888-0086
OpenAccessLink https://doaj.org/article/4381b49e3fa94cfc82b7bdd0a97bd89b
PQID 2629124687
PQPubID 4437233
PageCount 6
ParticipantIDs proquest_journals_2629124687
crossref_primary_10_1109_JEDS_2021_3129279
doaj_primary_oai_doaj_org_article_4381b49e3fa94cfc82b7bdd0a97bd89b
crossref_citationtrail_10_1109_JEDS_2021_3129279
ieee_primary_9621226
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 20220000
2022-00-00
20220101
2022-01-01
PublicationDateYYYYMMDD 2022-01-01
PublicationDate_xml – year: 2022
  text: 20220000
PublicationDecade 2020
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE journal of the Electron Devices Society
PublicationTitleAbbrev JEDS
PublicationYear 2022
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref13
ref24
Mitmann (ref9)
ref12
ref23
ref15
ref14
ref20
ref11
ref22
ref10
ref21
ref2
ref1
ref17
ref16
ref19
ref18
ref8
ref7
ref3
ref6
Schroeder (ref4) 2019
ref5
References_xml – ident: ref2
  doi: 10.1109/IEDM.2017.8268425
– ident: ref16
  doi: 10.1021/acsami.6b13866
– ident: ref7
  doi: 10.1109/VLSITechnology18217.2020.9265075
– ident: ref3
  doi: 10.1109/VLSITechnology18217.2020.9265063
– ident: ref22
  doi: 10.1109/IMW.2014.6849367
– ident: ref1
  doi: 10.1063/1.3634052
– ident: ref8
  doi: 10.1109/IEDM19573.2019.8993485
– ident: ref15
  doi: 10.1021/acsami.9b11146
– volume-title: Ferroelectricity in Doped Hafnium Oxide: Materials, Properties and Devices
  year: 2019
  ident: ref4
– ident: ref10
  doi: 10.1116/1.5134135
– ident: ref11
  doi: 10.1109/5.849164
– ident: ref21
  doi: 10.1063/1.4927805
– ident: ref5
  doi: 10.7567/jjap.53.08le02
– ident: ref17
  doi: 10.1109/IEDM.1998.746373
– ident: ref20
  doi: 10.1063/5.0035100
– ident: ref19
  doi: 10.1109/IEDM19573.2019.8993464
– start-page: 18.4.1
  volume-title: Proc. IEEE Int. Electron Devices Meeting (IEDM)
  ident: ref9
  article-title: Impact of oxygen on the performance of ferroelectric Hf0.5Zr0.5O₂ based devices
– ident: ref6
  doi: 10.1021/nl302049k
– ident: ref13
  doi: 10.1109/TDMR.2004.837210
– ident: ref14
  doi: 10.1016/j.actamat.2020.116515
– ident: ref23
  doi: 10.1109/VTSA.2008.4530807
– ident: ref24
  doi: 10.1109/ICICDT.2018.8399771
– ident: ref12
  doi: 10.1109/TDMR.2012.2216269
– ident: ref18
  doi: 10.1103/physrevb.66.214109
SSID ssj0000816966
Score 2.4441166
Snippet A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf 0.5 Zr 0.5 O 2...
A novel system-on-a-chip compatible one-transistor one-capacitor ferroelectric random-access memory array (1T1C FeRAM) based on ferroelectric Hf0.5Zr0.5O2 with...
SourceID doaj
proquest
crossref
ieee
SourceType Open Website
Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 29
SubjectTerms Arrays
capacitor under bitline
Capacitors
CUB
Electric potential
FeRAM
Ferroelectric films
Ferroelectric materials
Ferroelectric random-access memory
Ferroelectricity
hafnium oxide
Metallizing
Nonvolatile memory
post-metallization annealing
Random access memory
Semiconductor devices
Sense amplifiers
System on chip
Tin
Transistors
Voltage
zirconium oxide
SummonAdditionalLinks – databaseName: IEEE Electronic Library (IEL)
  dbid: RIE
  link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwEB61PcGBV0EsFORDTxXZJnbitY_dpatVpW0laEXFxfJTrUC7KGQP5dczdrxRBQj1lCixLScznoc98w3AoXNaeFOjb9KUoailcYXwwRaGB-1NMI1mMXd4ec4XV_XZdXO9Ax-GXBjvfQo-8-N4m87y3dpu4lbZseQoaCnfhd3JRPa5WsN-SiwggaZ7PrisSnl8dvrxMzqAtEK_lEoag7XuqZ6E0J9Lqvwlh5NymT-F5XZafUzJt_GmM2P76w_ExofO-xk8yVYmOenZ4jns-NULeHwPe3AfLqrLakbm_tPJkixjuO0dNm_1HZmiXnNkvcJ3bbvuy-TcWrL4ekG-3HY3ZIbq1aIcaEmqmUSmyG447Eu4mp9ezhZFrq5QWPQZu6LxTJQMyeEjQr7lMqAMRmXudGVLpw0LrG4a5irkNbTBhOPxENR5tGGkF7pkr2BvtV7510Akr7hhxqDpFcFwrDQoB7wXrLZUVqEeQbn98cpm6PFYAeO7Si5IKVWklYq0UplWIzgauvzocTf-13gaqTk0jJDZ6QFSQeUVqCKWmcGps6BlbYMV1EyMc6WWeBHSjGA_Um4YJBNtBAdb3lB5ef9UlON30ZqLyZt_93oLj2jMk0h7NQew17Ub_w6tl868T2z7G9mO60Q
  priority: 102
  providerName: IEEE
Title 1T1C FeRAM Memory Array Based on Ferroelectric HZO With Capacitor Under Bitline
URI https://ieeexplore.ieee.org/document/9621226
https://www.proquest.com/docview/2629124687
https://doaj.org/article/4381b49e3fa94cfc82b7bdd0a97bd89b
Volume 10
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVAFT
  databaseName: Open Access Digital Library
  customDbUrl:
  eissn: 2168-6734
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816966
  issn: 2168-6734
  databaseCode: KQ8
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: http://grweb.coalliance.org/oadl/oadl.html
  providerName: Colorado Alliance of Research Libraries
– providerCode: PRVAON
  databaseName: DOAJ Directory of Open Access Journals
  customDbUrl:
  eissn: 2168-6734
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816966
  issn: 2168-6734
  databaseCode: DOA
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: https://www.doaj.org/
  providerName: Directory of Open Access Journals
– providerCode: PRVHPJ
  databaseName: ROAD: Directory of Open Access Scholarly Resources
  customDbUrl:
  eissn: 2168-6734
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816966
  issn: 2168-6734
  databaseCode: M~E
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: https://road.issn.org
  providerName: ISSN International Centre
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV1LS8QwEA7iSQ_iE9cXOXgSis2j2eTorrssC6vgA8VLyBMF2ZW6Hvz3TtK6LAh68VRop2k7mcw30yTfIHTqvZHBcshNqjIWXFlfyBBdYUU0wUZbGZb2Dk-uxOiejx-rx6VSX2lNWEMP3CjuPFFQWa4Ci0ZxF52ktmu9L42Cg1Q2eV-AsaVkKvtgSQQE8u00JinV-XhweQvpICWQpVJF09KtJSDKfP1tgZUfXjlDzXATbbQxIr5o3m0LrYTpNlpfYg7cQdfkjvTxMNxcTPAkLZb9BPHafOIeoJLHsylcq-tZU-TmxeHR0zV-eJk_4z6Ao4NRXONc8Qj3wFig2V10Pxzc9UdFWxuhcJDxzYsqMFkyUGZI_PZOqAgeFKDYG-JKbyyLjFcV8wQsBSIo6UWawvQBIhAVpCnZHlqdzqZhH2EliLDMWgicEpWNUxZGcQiScUcVibyDym9FadcSh6f6Fa86JxCl0km3OulWt7rtoLPFLW8Na8Zvwr2k_YVgIrzOJ8AMdGsG-i8z6KCd1HeLRpQATKaig46--1K3g_NdUwHfRbmQ3YP_ePQhWqNpT0T-L3OEVuf1RziGSGVuT7JRnuRNhV-xXeQi
linkProvider Directory of Open Access Journals
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwEB6VcgAOvApioYAPnBDZJnbitY_dpaulNK0EW1FxsfwUFWgXheyh_HrGTjaqACFOiRLbcjLjedgz3wC8ck4Lb0r0Tao8ZKU0LhM-2MzwoL0JptIs5g7Xp3xxXh5fVBc78GbIhfHep-AzP4636Szfre0mbpUdSI6ClvIbcLNCr2LSZWsNOyqxhAQa7_3RZZHLg-Ojtx_RBaQFeqZU0hiudU35JIz-vqjKH5I4qZf5Pai3E-uiSr6ON60Z25-_YTb-78zvw93eziSHHWM8gB2_egh3rqEP7sFZsSxmZO4_HNakjgG3V9i80VdkiprNkfUK3zXNuiuUc2nJ4vMZ-XTZfiEzVLAWJUFDUtUkMkWGw2Efwfn8aDlbZH19hcyi19hmlWciZ0gQHzHyLZcBpTCqc6cLmzttWGBlVTFXILehFSYcj8egzqMVI73QOXsMu6v1yj8BInnBDTMGja8Ih2OlQUngvWClpbII5Qjy7Y9XtgcfjzUwvqnkhORSRVqpSCvV02oEr4cu3zvkjX81nkZqDg0jaHZ6gFRQ_RpUEc3M4NRZ0LK0wQpqJsa5XEu8CGlGsBcpNwzSE20E-1veUP0C_6Eox--iJReTp3_v9RJuLZb1iTp5d_r-GdymMWsi7dzsw27bbPxztGVa8yKx8C9eTu6V
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=1T1C+FeRAM+Memory+Array+Based+on+Ferroelectric+HZO+With+Capacitor+Under+Bitline&rft.jtitle=IEEE+journal+of+the+Electron+Devices+Society&rft.au=Okuno%2C+Jun&rft.au=Kunihiro%2C+Takafumi&rft.au=Konishi%2C+Kenta&rft.au=Materano%2C+Monica&rft.date=2022&rft.issn=2168-6734&rft.eissn=2168-6734&rft.volume=10&rft.spage=29&rft.epage=34&rft_id=info:doi/10.1109%2FJEDS.2021.3129279&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_JEDS_2021_3129279
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2168-6734&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2168-6734&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2168-6734&client=summon