Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors
The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. Dur...
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| Published in | Microelectronics and reliability Vol. 115; p. 113976 |
|---|---|
| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
01.12.2020
Elsevier |
| Subjects | |
| Online Access | Get full text |
| ISSN | 0026-2714 1872-941X |
| DOI | 10.1016/j.microrel.2020.113976 |
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| Abstract | The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability.
•Cyclic tension-compression response of rolled-annealed copper foil is captured•Kinematic hardening of copper is identified and modeled by a Chaboche approach•An original setup is developed to study the low-cycle fatigue of a copper foil•A low-cycle fatigue model is identified from tests with various strain amplitudes•The lifetime of a flexible PCB under cyclic folding is assessed via a FE simulation |
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| AbstractList | The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability. The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability. •Cyclic tension-compression response of rolled-annealed copper foil is captured•Kinematic hardening of copper is identified and modeled by a Chaboche approach•An original setup is developed to study the low-cycle fatigue of a copper foil•A low-cycle fatigue model is identified from tests with various strain amplitudes•The lifetime of a flexible PCB under cyclic folding is assessed via a FE simulation |
| ArticleNumber | 113976 |
| Author | Mercier, Sébastien Girard, Gautier Martiny, Marion |
| Author_xml | – sequence: 1 givenname: Gautier surname: Girard fullname: Girard, Gautier email: gautier.girard@univ-lorraine.fr – sequence: 2 givenname: Marion surname: Martiny fullname: Martiny, Marion – sequence: 3 givenname: Sébastien surname: Mercier fullname: Mercier, Sébastien |
| BackLink | https://hal.science/hal-03008248$$DView record in HAL |
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| CitedBy_id | crossref_primary_10_1016_j_compositesb_2023_110715 crossref_primary_10_1016_j_matchar_2023_113286 crossref_primary_10_1016_j_matdes_2023_111711 crossref_primary_10_1016_j_jmrt_2022_10_009 crossref_primary_10_1007_s10704_021_00591_2 crossref_primary_10_1007_s00170_024_14874_0 crossref_primary_10_3390_ma15062249 crossref_primary_10_1007_s10338_024_00521_4 crossref_primary_10_1016_j_ijfatigue_2023_107603 crossref_primary_10_1016_j_mtcomm_2022_105029 crossref_primary_10_1016_j_compstruct_2023_117497 crossref_primary_10_1016_j_est_2023_107792 crossref_primary_10_1038_s41586_024_08155_9 crossref_primary_10_3390_app13137941 crossref_primary_10_1016_j_microrel_2025_115632 crossref_primary_10_1016_j_jallcom_2024_178156 crossref_primary_10_1016_j_microrel_2024_115441 |
| Cites_doi | 10.1063/1.371461 10.1016/0749-6419(86)90010-0 10.1115/1.4043405 10.1016/j.ijfatigue.2013.04.005 10.1016/j.microrel.2016.03.034 10.1007/s11664-019-07237-z 10.1108/03056129910244842 10.1016/j.microrel.2011.11.021 10.1063/1.1809260 10.1016/S0921-5093(01)00990-X 10.1016/0749-6419(91)90050-9 10.1016/j.actamat.2013.12.006 10.1016/j.microrel.2013.08.005 10.1016/j.msea.2005.10.060 10.1016/j.ijfatigue.2012.01.009 10.1007/s10704-019-00393-7 10.1108/CW-09-2013-0032 10.1016/j.compstruct.2018.03.037 10.1557/PROC-695-L4.9.1 10.1016/j.microrel.2007.03.003 10.1007/BF02321056 10.1007/s11664-999-0176-x 10.1016/j.compositesa.2020.106075 10.1016/j.microrel.2017.12.045 |
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| Keywords | Printed circuit boards Mechanical tests Elastic-plastic behavior Kinematic hardening Copper film Low-cycle fatigue |
| Language | English |
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| Snippet | The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed... |
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| SubjectTerms | Copper film Elastic-plastic behavior Electronics Engineering Sciences Kinematic hardening Low-cycle fatigue Mechanical tests Mechanics Mechanics of materials Printed circuit boards |
| Title | Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors |
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