Girard, G., Martiny, M., & Mercier, S. (2020). Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors. Microelectronics and reliability, 115, 113976. https://doi.org/10.1016/j.microrel.2020.113976
Chicago Style (17th ed.) CitationGirard, Gautier, Marion Martiny, and Sébastien Mercier. "Experimental Characterization of Rolled Annealed Copper Film Used in Flexible Printed Circuit Boards: Identification of the Elastic-plastic and Low-cycle Fatigue Behaviors." Microelectronics and Reliability 115 (2020): 113976. https://doi.org/10.1016/j.microrel.2020.113976.
MLA (9th ed.) CitationGirard, Gautier, et al. "Experimental Characterization of Rolled Annealed Copper Film Used in Flexible Printed Circuit Boards: Identification of the Elastic-plastic and Low-cycle Fatigue Behaviors." Microelectronics and Reliability, vol. 115, 2020, p. 113976, https://doi.org/10.1016/j.microrel.2020.113976.