Solder fatigue failures in a new designed power module under Power Cycling - Durand, C.; Klingler, M.; Bigerelle, M.; Coutellier, D. (Microelectronics and reliability, 2016)
Keywords: creep; Engineering Sciences; Finite Elements Methods (FEM); lifetime; Mechanics; Modeling; power cycling; Power module; solder; thermomechanics; power cycling; Finite Elements Methods (FEM); lifetime; creep; thermomechanics; Modeling; solder; Power module; "solder"; "thermomechanics"; "Modeling"; "lifetime"; "Power module"; "Finite Elements Methods (FEM)"; "power cycling"; "creep"