韩建伟, 封. 上. 马. (2012). SEE characteristics of small feature size devices by using laser backside testing. Journal of semiconductors, 33(1), 72-76. https://doi.org/10.1088/1674-4926/33/1/014008
Chicago Style (17th ed.) Citation韩建伟, 封国强 上官士鹏 马英起. "SEE Characteristics of Small Feature Size Devices by Using Laser Backside Testing." Journal of Semiconductors 33, no. 1 (2012): 72-76. https://doi.org/10.1088/1674-4926/33/1/014008.
MLA (9th ed.) Citation韩建伟, 封国强 上官士鹏 马英起. "SEE Characteristics of Small Feature Size Devices by Using Laser Backside Testing." Journal of Semiconductors, vol. 33, no. 1, 2012, pp. 72-76, https://doi.org/10.1088/1674-4926/33/1/014008.
Warning: These citations may not always be 100% accurate.